Honeywell DCP552 Mark II ユーザーズマニュアル

Printed

Manual Number

Edition

Revised pages

Description

Date

Fly leaf

Addition of comment
SAFETY PRECAUTIONS deleated

i to viii

Page i, ii, iii deleated

5-4

3rd item on NOTE
Select ∆ SP setting→Select θ setting

5-20

Pare of explanation changed

5-27

Pare of Lise changed

6-6

Drawing and explanation replaced

6-7, 6-8

Explanation Handling Precautions
(unit:%C)→(unit:%)

7-6

Section of "PA40 Settings and descriptions"
-1000 to +1000 SPU(CH2)→
-1000 to +1000 PVU(CH1)

7-8

Section of "PA100 Settings and descriptions"
Addition of %

7-15

Section of Event type 89 Meaning Message"
Segment number binary SEG-BIN→
Segment number binary code SEG-BIN

7-29

Section of "C76 Settings and descriptions"
Addition of explanation

7-35

Explanation of "Io required in connecting one 
PGM"
the figure on the right,→the figure below

8-19

"

"and "

" replaced in the character Lise

11-5

Section of "Memory card Parameter"
Fixed command control data→
Constant value control data

11-6

•Ambient humidity range

0 to 90% RH→10 to 90% RH

•Vibration resistance Addition of explanation

Parameter Work

Section of "PA40 Settings and descriptions"

Sheet P.2

-1000 to +1000 SPU(CH2)→
-1000 to +1000 PVU(CH1)

4-3

Compensating lead wire specifications was deleted

8-1

NOTE was changed (CP-SP-1002E was abolished)

12-8

The table of Key test(00-01) was changed

12-12

Figure of Table 12-9 was added

12-17

Fig12-6, 12-7 was changed

1-5

"D0" of Additional processing item was deleted

4-16

Wirining diagram of RS-232C connection was 
changed

4-17

JIS code of NOTE table was deleted

5-10

Diagram of other functions was added

5-11 to 5-36

Old 5-10 to 5-35 pages

HONEYWELL

Company name and Adress of JAPAN were 

SERVICE CENTERS changed

fonts changed

4-16

The 2nd item of "Handling Precautions", 
'There are four (RD, SD, SG and FG) • • •' →
'There are three (RD, SD and SG) • • •' changed
and the 3rd item of "Handling Precautions"
deleted