Intel 200 사용자 설명서
Introduction
10
Thermal and Mechanical Design Guidelines
Term Description
(T
S
– T
A
) / Total Package Power.
Note: Heat source must be specified for Ψ measurements.
TIM
Thermal Interface Material: The thermally conductive compound between the
heatsink and the processor die surface. This material fills the air gaps and voids,
and enhances the transfer of the heat from the processor die surface to the
heatsink.
heatsink and the processor die surface. This material fills the air gaps and voids,
and enhances the transfer of the heat from the processor die surface to the
heatsink.
P
D
Processor total power dissipation (assuming all power dissipates through the
processor die).
processor die).
TDP
Thermal Design Power: a power dissipation target based on worst-case
applications. Thermal solutions should be designed to dissipate the thermal
design power.
applications. Thermal solutions should be designed to dissipate the thermal
design power.
P
USAGE
Maximum usage power of processor when running SysMark utility.
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