Fujifilm Xeon 5050 S26361-F3248-L300 데이터 시트

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S26361-F3248-L300
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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
73
Thermal Specifications
Notes:
1.
Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to 
 for 
discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile A should result in virtually no TCC activation. Furthermore, utilization of 
thermal solutions that do not meet processor Thermal Profile A will result in increased probability of TCC 
activation and may incur measurable performance loss. (Refer to 
 for details on TCC activation). 
3.
Thermal Profile B is representative of a volumetrically constrained platform. Please refer to 
 for 
discrete points that constitute the thermal profile.
4.
Implementation of Thermal Profile B will result in increased probability of TCC activation and measurable 
performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile B do not 
meet the processor’s thermal specifications and may result in permanent damage to the processor.
5.
Refer to the Dual-Core Intel
®
 Xeon
®
 Processor 5000 Series Thermal/Mechanical Design Guidelines for 
system and environmental implementation details.
 
Figure 6-2. Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Profiles 
40
45
50
55
60
65
70
0
10
20
30
40
50
60
70
80
90
100
Pow e r  [W]
Tc
a
s
e
 [
C
]
Therm al Profile B
Y = 0.260*x + 42.3
Thermal Profile A
Y = 0.203*x + 41.7
TCASE_M AX is a therm al solution design point. In actuality, units w ill not significantly exceed 
TCASE_M AX_A due to TCC activation.
TCASE_M AX_B@ TDP
TCASE_M AX_A@ TDP
40
45
50
55
60
65
70
0
10
20
30
40
50
60
70
80
90
100
Pow e r  [W]
Tc
a
s
e
 [
C
]
Therm al Profile B
Y = 0.260*x + 42.3
Thermal Profile A
Y = 0.203*x + 41.7
TCASE_M AX is a therm al solution design point. In actuality, units w ill not significantly exceed 
TCASE_M AX_A due to TCC activation.
TCASE_M AX_B@ TDP
TCASE_M AX_A@ TDP
Table 6-5. 
Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Profile A 
Table
Power (W)
T
CASE_MAX
 (
°
C)
Power (W)
T
CASE_MAX
 (
°
C)
P_profile_min
_A
=40.9
50.0
80
57.9
45
50.8
85
59.0
50
51.9
90
60.0
55
52.9
95
61.0
60
53.9
65
54.9
70
55.9
75
56.9