Intel C2338 FH8065501516761 데이터 시트
제품 코드
FH8065501516761
Intel
®
Atom™ Processor C2000 Product Family for Microserver
September 2014
Datasheet, Vol. 3 of 3
Order Number: 330061-002US
689
Volume 3—Operating Conditions and Power Requirements—C2000 Product Family
Absolute Maximum and Minimum Ratings
34
Operating Conditions and Power Requirements
34.1
Absolute Maximum and Minimum Ratings
For proper functional operation, all processor electrical and thermal requirements must
.
When the device is subjected to conditions outside the functional operation condition
limits, but within absolute maximum and minimum ratings, neither functionality nor
long-term reliability can be expected. If a device is returned to conditions within
functional operation limits after having been subjected to conditions outside these
limits, but within the absolute maximum and minimum ratings, the device may be
functional, but with its lifetime degraded depending on exposure to conditions
exceeding the functional operation condition limits.
At conditions exceeding absolute maximum and minimum ratings, neither functionality
nor long-term reliability can be expected. Moreover, if a device is subjected to these
conditions for any length of time, it will either not function or its reliability will be
severely degraded when returned to conditions within the functional operating
condition limits.
34.1.1
Component Storage Conditions Specification
This section applies to the component-level storage prior to board attach.
Environmental storage condition limits define the temperature and relative humidity to
which the device is exposed to while being stored in the applicable Intel shipping media
trays, reels, and moisture barrier bags and boxes, and the component is not electrically
connected.
34.1.1.1
Prior to Board-Attach
specifies absolute maximum and minimum storage temperature and
humidity limits for given time durations. Failure to adhere to the specified limits could
result in physical damage to the component. If this is suspected, Intel recommends a
visual inspection to determine possible physical damage to the silicon or surface
components.
Notes:
1.
Specified temperatures are not to exceed values based on data collected. Exceptions for surface mount
re-flow are specified by the applicable JEDEC standard. Non-adherence may affect processor reliability.
2.
Component product device storage temperature qualification methods may follow JESD22-A119 (low
temperature) and JESD22-A103 (high temperature) standards when applicable for volatile memory.
3.
Component stress testing is conducted in conformance with JESD22-A104.
4.
The JEDEC J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
Table 34-1. Storage Condition Ratings - Prior to Board-Attach
Symbol
Parameter
Minimum
Maximum
Unit
T
absolute storage
Device storage temperature when exceeded
for any length of time.
-25
125
°C
T
sustained storage time and
temperature
The minimum/maximum device storage
temperature for a sustained period of time.
-5
40
°C
T
short term storage
The ambient storage temperature and time for
up to 72 hours.
-25
85
°C
RH
sustained storage
The maximum device storage relative
humidity for up to 30 months.
60% at
24 °C