Hitachi GR2000 사용자 설명서
GR2000 Installation Guide
xlvi
GR2K-GA-1002
Rev. 6.03
Half-Size NIF Installation Examples .................................................................................................... 4-18
Example of No. of multicast group...................................................................................................... 4-25MPLS Backbone and Access Circuits ................................................................................................ 4-28Clock closed-loop prohibition ............................................................................................................. 4-56Conversion from Ethernet Frame to ATM Cells ................................................................................. 4-58Shaping at Overload ............................................................................................................................. 4-59Next_Hop resolution ............................................................................................................................. 4-66Network Configuration Requiring noinstall for aggregate Definition .............................................. 4-67Example for Specifying a nexthopself Parameter.............................................................................. 4-69
Configuration to use the device for communication between IPv6 terminals on the same link ... 4-70
Configuration to become object of ICMPv6 re-direct message transmission ................................ 4-70Typical Frame Relay Network with Bridge Connection ..................................................................... 4-77BPDU Frame Format Supported .......................................................................................................... 4-77Normal QoS Operation ......................................................................................................................... 4-79Failing QoS Operation with Heavy Load on RP ................................................................................. 4-80Failing QoS on ATM Interface (Transmitting Inbound-QoS-Defined Packets ontoATM Interface) ....................................................................................................................................... 4-80Network Configuration ......................................................................................................................... 4-82
Network patterns applicable to PIM-DM and PIM-SM ........................................................................ 4-85Inapplicable network pattern in PIM-DM ............................................................................................. 4-86Applicable PIM-SM network pattern .................................................................................................... 4-87
Example of No. of multicast group...................................................................................................... 4-25MPLS Backbone and Access Circuits ................................................................................................ 4-28Clock closed-loop prohibition ............................................................................................................. 4-56Conversion from Ethernet Frame to ATM Cells ................................................................................. 4-58Shaping at Overload ............................................................................................................................. 4-59Next_Hop resolution ............................................................................................................................. 4-66Network Configuration Requiring noinstall for aggregate Definition .............................................. 4-67Example for Specifying a nexthopself Parameter.............................................................................. 4-69
Configuration to use the device for communication between IPv6 terminals on the same link ... 4-70
Configuration to become object of ICMPv6 re-direct message transmission ................................ 4-70Typical Frame Relay Network with Bridge Connection ..................................................................... 4-77BPDU Frame Format Supported .......................................................................................................... 4-77Normal QoS Operation ......................................................................................................................... 4-79Failing QoS Operation with Heavy Load on RP ................................................................................. 4-80Failing QoS on ATM Interface (Transmitting Inbound-QoS-Defined Packets ontoATM Interface) ....................................................................................................................................... 4-80Network Configuration ......................................................................................................................... 4-82
Network patterns applicable to PIM-DM and PIM-SM ........................................................................ 4-85Inapplicable network pattern in PIM-DM ............................................................................................. 4-86Applicable PIM-SM network pattern .................................................................................................... 4-87
Chapter 5 - Installation Site Conditions ............................................... 5-1
Process of Falling-Dust Measurement.................................................................................................. 5-2Main Power Line Examples .................................................................................................................... 5-3Standard (Non-Redundant) Power Feeding with 100V ac Input ......................................................... 5-7Redundant Power Feeding with 100V ac Input .................................................................................... 5-7Standard (Non-Redundant) Power Feeding with 200V ac Input ......................................................... 5-8Redundant Power Feeding with 200V ac Input .................................................................................... 5-8Standard (Non-Redundant) Power Feeding with –48V or –60V dc Input ........................................... 5-9
Redundant Power Feeding with –48V or –60V dc Input ...................................................................... 5-9Airflow of GR2000-2S ........................................................................................................................... 5-13Airflow of GR2000-10H ......................................................................................................................... 5-14Airflow of GR2000-20H ......................................................................................................................... 5-14Airflow of GR2000-4 .............................................................................................................................. 5-15
Airflow of GR2000-10 ............................................................................................................................ 5-15Airflow of GR2000-20 ............................................................................................................................ 5-16
Redundant Power Feeding with –48V or –60V dc Input ...................................................................... 5-9Airflow of GR2000-2S ........................................................................................................................... 5-13Airflow of GR2000-10H ......................................................................................................................... 5-14Airflow of GR2000-20H ......................................................................................................................... 5-14Airflow of GR2000-4 .............................................................................................................................. 5-15
Airflow of GR2000-10 ............................................................................................................................ 5-15Airflow of GR2000-20 ............................................................................................................................ 5-16
Chapter 6 - Hardware Installation ......................................................... 6-1
Unpacking of GR2000-2S ....................................................................................................................... 6-1Unpacking of GR2000-4S ....................................................................................................................... 6-2Unpacking of GR2000-6H ....................................................................................................................... 6-3Unpacking of GR2000-10H ..................................................................................................................... 6-4Unpacking of GR2000-20H ..................................................................................................................... 6-5Unpacking of GR2000-4.......................................................................................................................... 6-6Unpacking of GR2000-10........................................................................................................................ 6-7Unpacking of GR2000-20........................................................................................................................ 6-8Unpacking of Separately Shipped RM/RP/NIF Full Size Board........................................................... 6-9Unpacking of Separately Shipped NIF Half Size Board ....................................................................... 6-9Unpacking of Separately Shipped Memory Module........................................................................... 6-10
Unpacking of Flash Memory Card (MC) .............................................................................................. 6-10Unpacking of Separately Shipped Cable ............................................................................................ 6-11
Sample Handling of Module on Anti-Static Surface .......................................................................... 6-11
Unpacking of Flash Memory Card (MC) .............................................................................................. 6-10Unpacking of Separately Shipped Cable ............................................................................................ 6-11
Sample Handling of Module on Anti-Static Surface .......................................................................... 6-11