Fujitsu MAP3147FC Manual Do Utilizador

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C141-E163
5-1
CHAPTER 5  
Installation
5.1
Notes on Handling Drives
5.2
Setting
5.3
Mounting Drives
5.4Dismounting Drives
5.5
Checking Operation after Installation and Preparing
the IDD for Use
5.6
Spare Disk Drive
This chapter describes the notes on handling drives, setting, mounting drives, confirming drive operations
after installation and preparation for use, and dismounting drives.
5.1
Notes on Handling Drives
The items listed in the specifications in Table 2.1 must be strictly observed.
(1)
General notes
a) Do not give the drive shocks or vibrations exceeding the value defined in the standard because it
may cause critical damage to the drive.  Especially be careful when unpacking.
b) Do not leave the drive in a dirty or contaminated environment.
c) Since static discharge may destroy the CMOS semiconductors in the drive, note the following
after unpacking:
  Use an antistatic mat and body grounding when handling the drive.
  Hold the DE when handling the drive.  Do not touch PCAs except for setting.
Hot temperature
To  prevent  injury,  do  not  handle  the  drive  until  after  the  device  has  cooled
sufficiently  after  turning  off  the  power.    The  DE  and  LSI  become  hot  during
operation and remain hot immediately after turning off the power.