Toshiba TLP848 Manual Do Utilizador
TLP848
2007-10-01
1
TOSHIBA Photointerrupter Infrared LED + Phototransistor
TLP848
○
Camera Module for Mobile Phone
○
Digital Still Camera and Video Camera
○
Personal Equipment and Small-sized OA Equipment
The TLP848 is a surface-mount photointerrupter which is composed of a
GaAs infrared LED and a Si phototransistor.
It is an ultra compact package. Moreover it has a wider gap width than
1mm gap width of industry-standard and has a high resolution.
• Ultra compact package : 2.8×1.9×2.5mm (typ.)
• Surface-mount type
• Lead(Pb)-Free
• Gap width : 1.2mm (typ.)
• High resolution : Slit width 0.3 mm (typ.)
• High current transfer ratio : I
• Ultra compact package : 2.8×1.9×2.5mm (typ.)
• Surface-mount type
• Lead(Pb)-Free
• Gap width : 1.2mm (typ.)
• High resolution : Slit width 0.3 mm (typ.)
• High current transfer ratio : I
C
/I
F
= 3% (min)
• Material of the package :
PPS (Polyphenylene sulfide)
(UL94V-0)
Absolute Maximum Ratings
(Ta
= 25°C
) Marking (Note 2)
Characteristics Symbol
Rating
Unit
Forward current
I
F
30 mA
Forward current derating (Ta>25°C)
ΔI
F/
°C
−0.33 mA/°C
LED
Reverse voltage
V
R
5 V
Collector-emitter voltage
V
CEO
15 V
Emitter-collector voltage
V
ECO
5 V
Collector power dissipation
P
C
75 mW
Collector power dissipation derating
(Ta>25℃)
ΔP
C/
°C
−1 mW/°C
Detector
Collector current
I
C
50 mA
Operating temperature range
T
opr
−30 to 85
°C
Storage temperature range
T
stg
−40 to 100
°C
Soldering temperature (Note 1)
T
sol
250 °C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The reflow time and the example of temperature profile are shown in the section entitled Mounting Method.
Note 2: Weekly code: (Three digits)
TOSHIBA 11-3B1
Weight: 0.017 g (typ.)
Weekly Code
Week of manufacture
(01 for first week of year, continues up to 52 or 53)
(01 for first week of year, continues up to 52 or 53)
Year of manufacture
(One low-order digits of calendar year)
(One low-order digits of calendar year)