Kingston Technology 2GB 1333MHz DDR3 ECC Reg w/Parity CL9 DIMM DR, x8 w/Therm Sen (Intel) KVR1333D3D8R9S/2GI Ficha De Dados
![Kingston Technology](https://files.manualsbrain.com/attachments/a6e508062254fab8066e1b4b9d6a1595ae159f6d/common/fit/150/50/d687ccaf634e1bbf49128d06d450fd6e714fb24a70b982b60c2468f43ef6/brand_logo.jpeg)
Códigos do produto
KVR1333D3D8R9S/2GI
Memory Module Specifications
KVR1333D3D8R9S/2GI
2GB 256M x 72-Bit PC3-10600
CL9 Registered w/Parity 240-Pin DIMM
CL9 Registered w/Parity 240-Pin DIMM
Kingston.com
Document No. VALUERAM0817-001.A00 08/03/09 Page 1
DESCRIPTION
This document describes ValueRAM’s 256M x 72-bit 2GB
(2048MB) DDR3-1333 CL9 SDRAM (Synchronous DRAM),
Intel
(2048MB) DDR3-1333 CL9 SDRAM (Synchronous DRAM),
Intel
®
Compatibility Tested, registered w/parity, dual-rank
memory module, based on eighteen 128M x 8-bit DDR3-
1333 FBGA components. The SPD is programmed to JEDEC
standard latency 1333Mhz timing of 9-9-9 at 1.5V. This 240-pin
DIMM uses gold contact fingers and requires +1.5V. The
electrical and mechanical specifications are as follows:
1333 FBGA components. The SPD is programmed to JEDEC
standard latency 1333Mhz timing of 9-9-9 at 1.5V. This 240-pin
DIMM uses gold contact fingers and requires +1.5V. The
electrical and mechanical specifications are as follows:
FEATURES
• JEDEC standard 1.5V ± 0.075V Power Supply
• VDDQ = 1.5V ± 0.075V
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 6,7,8,9,10
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7(DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
• VDDQ = 1.5V ± 0.075V
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 6,7,8,9,10
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7(DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does
not allow seamless read or write [either on the fly using A12
or MRS]
not allow seamless read or write [either on the fly using A12
or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• On-DIMM thermal sensor (Grade B)
• Average Refresh Period 7.8us at lower than TCASE 85°C,
• On-DIMM thermal sensor (Grade B)
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE ≤ 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component
• PCB : Height 1.180” (30.00mm), double sided component
SPECIFICATIONS
CL(IDD)
9 cycles
Row Cycle Time (tRCmin)
49.5ns (min.)
Refresh to Active/Refresh
110ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin)
36ns (min.)
Power
3.480 W (operating)
UL Rating
94 V - 0
Operating Temperature
0° C to 85° C
Storage Temperature
-55° C to +100° C
Continued >>