Справочник Пользователя для Philips PNX2000

9397 750 13928

© Koninklijke Philips Electronics N.V. 2004. All rights reserved.

[3]

These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no 
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with 
peak temperature exceeding 217

°

C 

±

10

°

C measured in the atmosphere of the reflow oven. The package 

body peak temperature must be kept as low as possible.

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the 
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink 
on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

°

 angle to the solder wave 

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is 
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; 
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Hot bar or manual soldering is suitable for PMFP packages.

03

20040823

Minor revision (9397 750 13928)

02

20040712

Upgraded to Product data (9397 750 13591). 

 and 

 added.

01

20040504

Preliminary data (9397 750 12066)