Справочник Пользователя для Intel DX58OG BLKDX58OG

Модели

BLKDX58OG

• -20° C to +70° C

reGuLAtioNS ANd SAfetY StANdArdS

united States and canada

UL 1950, Third edition—CAN/CSA C22.2

No. 950-95 with recognized U.S. and Canadian

component marks
europe

Nemko certified to EN 60950 International

Nemko certified to IEC 60950

(CB report with CB certificate)
eMc regulations (tested in representative chassis)

united States

FCC Part 15, Class B

FCC Part 15, Class B open-chassis (cover off) testing
canada

ICES-003, Class B
europe

EMC directive 89/336/EEC; EN 55022:1998

Class B; EN 55024:1998
Australia/New Zealand

AS/NZS 3548, Class B
taiwan

CNS 13438, Class B International

CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF via

EN55022 +6 db in system configurations with an

open chassis and EU Directive 89/336/EEC and use

via EN55022 and EN50082-1 in a representative

chassis.
Lead-free: The symbol is used to identify electrical

and electronic assemblies and components

in which the lead (Pb) concentration level in

any of the raw materials and the end prod-

uct is not greater than 0.1% by weight (1000 ppm).

This symbol is also used to indicate conformance

to lead-free requirements and definitions adopted

under the European Union’s Restriction on Hazardous

Substances (RoHS) directive, 2002/95/EC.

ProceSSor

Processor Support

• Intel® Core™ i7 processors in the LGA1366 package

• Intel® Turbo Boost Technology

• Intel® Hyper-Threading Technology

• Integrated Memory Controller with support for up

to 48 GB

of system memory DDR3 +1600

1333 / 1066 MHz SDRAM

• Intel® Fast Memory Access

• Supports Intel® 64 architecture

cHiPSet

intel® X58 express chipset

• Intel® 82X58 IOH with ICH10R

• Intel® Matrix Storage Manager (RAID 0, 1, 5, 10)

• Two SATA (6.0 Gb/s) ports and 6 SATA (3.0 Gb/s) ports

uSB PortS

integrated intel® icH10r controller

• Six Hi-Speed USB 2.0 ports via back panel

• Six additional Hi-Speed USB 2.0 ports via three

internal headers

• Two SuperSpeed USB 3.0 ports via NEC controller
System BioS

• 32 Mb Flash EEPROM with Intel® Platform

Innovation Framework for EFI Plug and Play, IDE

drive auto-configure

• Advanced configuration and power interface

V3.0b, DMI 2.5
intel® rapid BioS Boot

• Intel® Rapid BIOS Boot

• Intel® Express BIOS update support: BIOS update

via new F7 function key

Warning: Altering clock frequency and/or voltage may (i) reduce

system stability and useful life of the system and processor; (ii)

cause the processor and other system components to fail; (iii)

cause reductions in system performance; (iv) cause additional

heat or other damage; and (v) affect system data integrity. Intel

has not tested, and does not warranty, the operation of the

processor beyond its specifications.

The Intel® Core Utilities Bundle includes Intel® Integrator Assis-

tant, Intel® Integrator Toolkit, Intel® Express Installer, and Intel®

Express BIOS Update.

Intel® Extreme Tuning Utility is only compatible with Intel® Desk-

top Boards based on the Intel® X38 Express Chipset and newer.

Auto-tuning capabilities may not be available for all Extreme

Series motherboards.

Intel® Turbo Boost Technology requires a PC with a processor with

Intel Turbo Boost Technology capability. Intel Turbo Boost Technol-

ogy performance varies depending on hardware, software, and

overall system configuration. Check with your PC manufacturer on

whether your system delivers Intel Turbo Boost Technology. See

www.intel.com/technology/turboboost for more information.

Intel® Hyper-Threading Technology requires a computer system

with a processor supporting HT Technology and an HT Technol-

ogy-enabled chipset, BIOS, and operating system. Performance

will vary depending on the specific hardware and software you

use. For more information including details on which processors

support HT Technology, see www.intel.com/info/hyperthreading.

Intel® Desktop Board DX58OG Extreme Series

Technical Specifications

Hardware Management features

• Processor fan speed control

• System chassis fan speed control

• Voltage and temperature sensing

• Fan sensor inputs used to monitor fan activity

• Power management support for ACPI 3.0b
intel® Pro 10/100/1000 Network connection

• LAN on the back panel

• New low-power design can meet ENERGY STAR*

5.0 specifications
expansion capabilities

• Two PCI Express* 2.0 x16 connectors (configured

as x16 / x16 in dual-graphics mode)

• Three PCI Express 2.0 x1 connectors

• One PCI connector
Audio

• 8-channel Intel® High Definition Audio

codec

• 6-channel via the back panel

• 2-channel via the front panel

• One internal header for S/PDIF output for HDMI*

support

SYSteM MeMorY

Memory capacity

• Six 240-pin DIMM connectors supporting triple-

channel memory. Two double-sided DIMMs per

channel.

• Maximum system memory up to 48 GB

using 8 GB

double-sided DIMMs
Memory types

• DDR3 +1600 / 1333 / 1066 SDRAM memory support

• Non-ECC Memory
Memory Modes

• Triple-, dual-, or single-channel operation support
Memory Voltage

• 1.35 V low voltage

• 1.5 V standard JEDEC voltage

• Support for Intel® XMP extended voltage profiles

JuMPerS ANd froNt-PANeL coNNectorS

Jumpers

• Single configuration jumper design

• Jumper access for BIOS maintenance mode
front-Panel connectors

• Reset, HD LED, Power LEDs, power on/off

• Three front-panel Hi-Speed USB 2.0 headers

• Front-panel audio header

• One IEEE 1394a header

MecHANicAL

Board Style

• ATX
Board Size

• 9.6” x 11.6” (24.38 cm x 29.46 cm)
Baseboard Power requirements

• ATX 12 V

eNViroNMeNt

operating temperature

• 0° C to +55° C
Storage temperature

For ordering information, visit www.intel.com
For the most current product information, visit www.intel.com/go/idb
or http://ark.intel.com
For specific CPU compatibility, visit http://processormatch.intel.com

Maximum peak memory bandwidth requires three DDR3 modules

to be populated in each of the blue memory slots. DDR3 1600

memory support on this motherboard requires advanced knowl-

edge of BIOS and memory tuning; individual results may vary.

For specific supported memory for this motherboard, please visit

www.intel.com/products/motherboard/ for more details.

System resources and hardware (such as PCI and PCI Express*)

require physical memory address locations that can reduce avail-

able addressable system memory. This could result in a reduction

of as much as 1 GB or more of physical addressable memory being

available to the operating system and applications, depending on

the system configuration and operating system.

Intel® High Definition Audio requires a system with an appropriate

Intel® chipset and a motherboard with an appropriate codec and

the necessary drivers installed. System sound quality will vary

depending on actual implementation, controller, codec, drivers,

and speakers. For more information about Intel® HD Audio, refer

to www.intel.com/design/chipsets/hdaudio.htm

64-bit computing on Intel® architecture requires a computer

system with a processor, chipset, BIOS, operating system, device

drivers, and applications enabled for Intel® 64 architecture.

Processors will not operate (including 32-bit operation) without

an Intel 64 architecture-enabled BIOS. Performance will vary

depending on your hardware and software configurations. See

http://developer.intel.com/technology/intel64/index.htm for

more information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION

WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY

RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,

INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DIS-

CLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO

SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY

OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR

PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PAT-

ENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.

Intel products are not intended for use in medical, life-saving,

or life-sustaining applications. Intel may make changes to speci-

fications and product descriptions at any time, without notice.

All products, dates, and figures specified are preliminary based

on current expectations, and are subject to change without

notice. Availability in different channels may vary.

Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, and Intel Core are trademarks of Intel

Corporation in the U.S. and other countries.

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