Справочник Пользователя (BX80570E8500A)Содержание1 Introduction111.1 Document Goals and Scope111.1.1 Importance of Thermal Management111.1.2 Document Goals111.1.3 Document Scope121.2 References131.3 Definition of Terms132 Processor Thermal/Mechanical Information152.1 Mechanical Requirements152.1.1 Processor Package152.1.2 Heatsink Attach172.1.2.1 General Guidelines172.1.2.2 Heatsink Clip Load Requirement172.1.2.3 Additional Guidelines182.2 Thermal Requirements182.2.1 Processor Case Temperature182.2.2 Thermal Profile192.2.3 Thermal Solution Design Requirements192.2.4 TCONTROL202.3 Heatsink Design Considerations212.3.1 Heatsink Size222.3.2 Heatsink Mass222.3.3 Package IHS Flatness232.3.4 Thermal Interface Material232.4 System Thermal Solution Considerations242.4.1 Chassis Thermal Design Capabilities242.4.2 Improving Chassis Thermal Performance242.4.3 Summary252.5 System Integration Considerations253 Thermal Metrology273.1 Characterizing Cooling Performance Requirements273.1.1 Example283.2 Processor Thermal Solution Performance Assessment293.3 Local Ambient Temperature Measurement Guidelines293.4 Processor Case Temperature Measurement Guidelines324 Thermal Management Logic and Thermal Monitor Feature334.1 Processor Power Dissipation334.2 Thermal Monitor Implementation334.2.1 PROCHOT# Signal344.2.2 Thermal Control Circuit344.2.2.1 Thermal Monitor344.2.3 Thermal Monitor 2354.2.4 Operation and Configuration364.2.5 On-Demand Mode374.2.6 System Considerations374.2.7 Operating System and Application Software Considerations384.2.8 THERMTRIP# Signal384.2.9 Cooling System Failure Warning384.2.10 Digital Thermal Sensor384.2.11 Platform Environmental Control Interface (PECI)395 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information415.1 Overview of the BTX Reference Design415.1.1 Target Heatsink Performance415.1.2 Acoustics425.1.3 Effective Fan Curve435.1.4 Voltage Regulator Thermal Management445.1.5 Altitude455.1.6 Reference Heatsink Thermal Validation455.2 Environmental Reliability Testing455.2.1 Structural Reliability Testing455.2.1.1 Random Vibration Test Procedure455.2.1.2 Shock Test Procedure465.2.2 Power Cycling475.2.3 Recommended BIOS/CPU/Memory Test Procedures485.3 Material and Recycling Requirements485.4 Safety Requirements495.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly495.6 Preload and TMA Stiffness505.6.1 Structural Design Strategy505.6.2 TMA Preload verse Stiffness506 ATX Thermal/Mechanical Design Information536.1 ATX Reference Design Requirements536.2 Validation Results for Reference Design556.2.1 Heatsink Performance556.2.2 Acoustics566.2.3 Altitude566.2.4 Heatsink Thermal Validation576.3 Environmental Reliability Testing576.3.1 Structural Reliability Testing576.3.1.1 Random Vibration Test Procedure576.3.1.2 Shock Test Procedure586.3.2 Power Cycling596.3.3 Recommended BIOS/CPU/Memory Test Procedures606.4 Material and Recycling Requirements606.5 Safety Requirements616.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design616.7 Reference Attach Mechanism626.7.1 Structural Design Strategy626.7.2 Mechanical Interface to the Reference Attach Mechanism637 Intel® Quiet System Technology (Intel® QST)657.1 Intel® QST Algorithm657.1.1 Output Weighting Matrix667.1.2 Proportional-Integral-Derivative (PID)667.2 Board and System Implementation of Intel® QST687.3 Intel® QST Configuration & Tuning707.4 Fan Hub Thermistor and Intel® QST70Размер: 3,3 МБСтраницы: 128Язык: EnglishПросмотреть