3M anisotropic conductive film adhesive 7313 tech bulletin 用户手册
Technical Bulletin
Anisotropic Conductive Film Adhesive 7313
Bonding Process Development
Bonding Process Development
Film Tacking
In many applications, the ACF 7313 is first pre-attached to one pad surface. This
step is referred to as “tacking” the film. The ACF 7313 is essentially non-tacky at
room temperature. Heating it to 85-105°C will make the film sufficiently tacky so
that it can be adhered to the pad location on one of the circuits. Once the film has
cooled again, the carrier release liner can be removed while the adhesive remains
attached to the pad location. The temperature of the tacking step should be kept
below the melt temperature of the film. Tacking does not affect the shelf life of the
film, and tacked parts may be stored at room temperature prior to proceeding to
subsequent processing steps. Methods of tacking include:
step is referred to as “tacking” the film. The ACF 7313 is essentially non-tacky at
room temperature. Heating it to 85-105°C will make the film sufficiently tacky so
that it can be adhered to the pad location on one of the circuits. Once the film has
cooled again, the carrier release liner can be removed while the adhesive remains
attached to the pad location. The temperature of the tacking step should be kept
below the melt temperature of the film. Tacking does not affect the shelf life of the
film, and tacked parts may be stored at room temperature prior to proceeding to
subsequent processing steps. Methods of tacking include:
• Heating the film, for example with a hot-plate or infra-red lamp, and
applying it to an unheated substrate.
• Placing unheated film on a heated substrate, for example by placing the
substrate on a hot-plate.
• Placing unheated film on an unheated substrate and then heating both
together, for example by feeding them through a heated laminator.
Circuit Aligning
The circuits must be brought in proper registration before bonding. This alignment
step is normally performed using a camera and fixturing set-up or a microscope.
Once the circuits are properly aligned they may require another tacking step to
temporarily hold the assembly together. This tacking step can be performed in
similar manner as the film tacking method described above. The circuits may not
require this tacking step if the bonding equipment is designed to fixture the parts for
both alignment and bonding operations.
step is normally performed using a camera and fixturing set-up or a microscope.
Once the circuits are properly aligned they may require another tacking step to
temporarily hold the assembly together. This tacking step can be performed in
similar manner as the film tacking method described above. The circuits may not
require this tacking step if the bonding equipment is designed to fixture the parts for
both alignment and bonding operations.
- 2 -
General Bonding
Considerations
(continued)
Considerations
(continued)
1.E+07
1.E+06
1.E+05
1.E+04
1.E+03
25
50
75
100
125
150
0.1
1
10
G' (Pa)
G" (Pa)
tan delta
Tm
Temperature (
°
C)
Shear Stor
age Modulus (P
a)
T
a
n Delta
Figure 1. Dynamic mechanical properties of ACF 7313 measured in torsion at a frequency of 1 radian
per second. Data shown are storage and loss shear modulii (G' and G") and tan delta as a function of
temperature.
per second. Data shown are storage and loss shear modulii (G' and G") and tan delta as a function of
temperature.
DMA 3M™ Anisotropic Conductive Film Adhesive 7313