jetway 939gt4slir311 用户手册

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页码 63
 
 
 
                                                                                                                                                                                                                                                                                                                                                
 
 
 
 
ii 
USER’S NOTICE 
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER.  NO PART OF THIS 
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE 
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR 
BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER. 
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE 939GT4SLI  MOTHER-
BOARD AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL 
CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS 
MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY 
INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING 
DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, 
INTERRUPTION OF BUSINESS AND THE LIKE).  
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL  MAY OR MAY NOT BE 
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND 
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S 
BENEFIT, WITHOUT INTENT TO INFRINGE. 
 
Manual Revision Information 
Reversion   
Revision History    
Date 
3.0   
 
Third Edition       
June 2005 
Item Checklist 
5
 
939GT4-SLI-D/ 939GT4-SLI-G/ 939GT4-SLI-P motherboard 
5
 
Cable for IDE/Floppy 
5
 
CD for motherboard utilities 
5
 
SLI Supported Bridge 
5
 
Cable for Serial ATA IDE Port 
5
 
SPDIF-IN/SPDIF-OUT Adaptor  
5
 
939GT4-SLI-D/ 939GT4-SLI -G/ 939GT4-SLI-P User’s Manual 
AMD K8 Processor Family 
Cooling Solutions 
As processor technology pushes to faster speeds and higher performance with increasing operation 
clock, thermal management becomes increasingly crucial while building computer systems. Maintaining 
the proper computing environment without thermal increasing is the key to reliable, stable, and 24 
hours system operation. The overall goal is keeping the processor below its specified maximum case 
temperature. Heatsinks induce improved processor heat dissipation through increasing surface area 
and concentrated airflow from attached active cooling fans. In addition, interface materials allow 
effective transfers of heat from the processor to the heatsink. For optimum heat transfer, AMD 
recommends the use of thermal grease and mounting clips to attach the heatsink to the processor.  
Please refer to the website below for collection of heatsinks evaluated and recommended for Socket-
939 processors by AMD. In addition, this collection is not intended to be a comprehensive listing of 
all heatsinks that support Socket-939 processors.  
For vendor list of heatsinks and Active cooling fans, please visit: 
http://www.amd.com/us-en/Processors/DevelopWithAMD/0,,30_2252_869_9460^9515,00.html