Toshiba Xeon 2.8GHz UPG3843W 用户手册

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The 1U solution contains a passive heatsink and a foam pad, in addition to the retention solution 
included with the other options. Because of the small form factor, the 1U heatsink is not as efficient 
at dissipating heat as the general-purpose heatsink. In order to ensure maximum thermal efficiency, 
the foam pad must be attached to the top of the 1U heatsink, blocking airflow between the heatsink 
and the chassis cover. This will force air through the heatsink fins instead of allowing it to bypass 
over the top. See 

 and 

 for more detail on installation.