Toshiba Xeon 2.8GHz UPG3843W 用户手册

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The Intel® Xeon™ processor with 512 KB L2 cache uses Interposer Micro Pin Grid Array (INT-
mPGA) package technology. Components of the package include a flip-chip ball grid array (FC-
BGA) package containing the processor die covered by an integrated heat spreader (IHS) mounted
to a pinned FR4 interposer. Mechanical specifications for the processor are given in this section.
See 

 for terminology definitions. 

 provides a basic assembly drawing and

includes the components which make up the entire processor. In addition to the package
components, several components are located on the FR4 interposer, including an EEPROM and a
thermal sensor. Package dimensions are provided in 

.

The Intel® Xeon™ processor with 512 KB L2 cache utilizes a surface mount 603-pin zero-
insertion force (ZIF) socket for installation into the baseboard. See the 603-Pin Socket Design
Guidelines for further details on the processor socket.

For 

 through 

, the following notes apply:

1. Unless otherwise specified, the following drawings are dimensioned in millimeters.

2. All dimensions are not tested, but are guaranteed by design characterization.

3. Figures and drawings labelled as “Reference Dimensions” are provided for informational

purposes only. Reference Dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference Dimensions are
NOT checked as part of the processor manufacturing process. Unless noted as such,
dimensions in parentheses without tolerances are Reference Dimensions.

4. Drawings are not to scale.

Note: This drawing is not to scale and is for reference only. The 603-pin socket is supplied as a

reference only.

1. Integrated Heat Spreader (IHS)

2. Thermal Interface Material (TIM) between processor die and IHS

3. Processor die

4. Flip Chip interconnect

5. FCBGA (Flip Chip Ball Grid Array) package

6. FCBGA solder joints

7. Processor interposer

8. 603-pin socket

9. 603-pin socket solder joints