Toshiba Xeon 2.8GHz UPG3843W 用户手册
产品代码
UPG3843W
Intel® Xeon™ Processor with 512 KB L2 Cache
Datasheet
95
6.0
Thermal Specifications
This chapter provides the thermal specifications necessary for designing a thermal solution for the
Intel
Intel
®
Xeon™ processor with 512 KB L2 cache. Thermal solutions should include heatsinks that
attach to the integrated heat spreader (IHS). The IHS provides a common interface intended to be
compatible with many heatsink designs. Thermal specifications are based on the temperature of the
IHS top, referred to as the case temperature, or T
compatible with many heatsink designs. Thermal specifications are based on the temperature of the
IHS top, referred to as the case temperature, or T
CASE
. Thermal solutions should be designed to
maintain the processor within T
CASE
specifications. For information on performing T
CASE
measurements, refer to the Intel® Xeon™ Processor Thermal Design Guidelines. See
for
an exploded view of the processor package and thermal solution assembly.
Note:
The processor is either shipped alone or with a heatsink (boxed processor only). All other
components shown in
components shown in
must be purchased separately.
Note:
This is a graphical representation. For specifications, see each component’s respective
documentation listed in
documentation listed in
.
Figure 37. Processor with Thermal and Mechanical Components - Exploded View
EMI ground
fram e
fram e
Heat sink clip
Heat sink
Retention
m echanism
m echanism
603-pin
socket
socket
EMI ground
fram e
fram e
Heat sink clip
Heat sink
Retention
m echanism
m echanism
603-pin
socket
socket