用户手册 — Sony GDM-F500T9

目录

• GDM-F500/F500T9

  1
  • POWER SAVING FUNCTION

    3
  • DIAGNOSIS

    3
  • TIMING SPECIFICATION

    4
• 1. GENERAL

  6
• 2. DISASSEMBLY

  14
  • 2-1. CABINET REMOVAL

    14
  • 2-2. D BOARD REMOVAL

    14
  • 2-3. G BOARD REMOVAL

    15
  • 2-4. A BORD REMOVAL

    15
  • 2-5. L BOARD REMOVAL

    16
  • 2-6. SERVICE POSITION

    16
  • 2-7. H1, H2 AND J BOARDS REMOVAL

    17
  • 2-8. US BOARD REMOVAL

    17
  • 2-9. PICTURE TUBE REMOVAL

    18
  • 2-10. HARNESS LOCATION

    19
• 3. SAFETY RELATED ADJUSTMENT

  20
• 4. ADJUSTMENTS

  21
• 5. DIAGRAMS

  23
  • 5-1. BLOCK DIAGRAMS

    23
  • 5-2. FLAME SCHEMATIC DIAGRAM

    25
  • 5-3. CIRCUIT BOARDS LOCATION

    26
  • 5-4. SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS

    26
    • (1) SCHEMATIC DIAGRAMS OF D (1/2, 2/2) BOARD

      27
    • (2) SCHEMATIC DIAGRAMS OF G, H1, H2, J AND L BOARDS

      28
    • (3 )SCHEMATIC DIAGRAM OF A BOARD

      30
    • (4) SCHEMATIC DIAGRAM OF US BOARD (-11) (OLD) (-11) (OLD)

      32
    • (5) SCHEMATIC DIAGRAM OF US BOARD (-12, -13) (NEW)

      34
  • 5-5. SEMICONDUCTORS

    35
• 6. EXPLODED VIEWS

  37
  • 6-1. CHASSIS

    37
  • 6-2. PICTURE TUBE

    38
  • 6-3. PACKING MATERIALS

    39
• 7. ELECTRICAL PARTS LIST

  41
  • A

    41
  • G

    45
  • D

    49
  • H1

    56
  • H2

    56
  • J

    56
  • L

    57
  • US

    58