Intel Xeon W5580 AT80602000756AD Benutzerhandbuch
Produktcode
AT80602000756AD
Boxed Processor Specifications
138
Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1
8.1.3
Intel Boxed “Active” Heat Sink Solution
The Boxed Active solution will be available for purchase for processors with TDP’s of
80W and lower and will be an aluminum extrusion. This heat sink solution is intended
to be used as an active heat sink only for pedestal chassis.
80W and lower and will be an aluminum extrusion. This heat sink solution is intended
to be used as an active heat sink only for pedestal chassis.
representation of the heat sink solution.
Both active solutions will utilize a fan capable of 4-pin pulse width modulated (PWM)
control. Use of a 4-pin PWM controlled active thermal solution helps customers meet
acoustic targets in pedestal platforms through the baseboard’s ability to directly control
the RPM of the processor heat sink fan. See
control. Use of a 4-pin PWM controlled active thermal solution helps customers meet
acoustic targets in pedestal platforms through the baseboard’s ability to directly control
the RPM of the processor heat sink fan. See
for more details on fan speed
control, also see
for more on the PWM and PECI interface along with Digital
Thermal Sensors (DTS).
Figure 8-1. Boxed Active Heat Sink
Figure 8-2. Boxed Passive / Active Combination Heat Sink (With Removable Fan)