Intel E3400 AT80571RG0641ML Benutzerhandbuch
Produktcode
AT80571RG0641ML
92
Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package
Datasheet
Boxed Processor Specifications
8.2
Mechanical Specifications
8.2.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed Celeron processor on
0.13 micron process. The boxed processor will be shipped with an unattached fan heatsink.
0.13 micron process. The boxed processor will be shipped with an unattached fan heatsink.
shows a mechanical representation of the boxed Celeron
processor on 0.13 micron
process.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The
physical space requirements and dimensions for the boxed processor with assembled fan heatsink
are shown in
physical space requirements and dimensions for the boxed processor with assembled fan heatsink
are shown in
(Side Views), and
(Top View). The airspace requirements for the
boxed processor fan heatsink must also be incorporated into new motherboard and system designs.
Airspace requirements are shown in
Airspace requirements are shown in
and
. Note that some figures have center
lines shown (marked with alphabetic designations) to clarify relative dimensioning.
Figure 39. Side View Space Requirements for the Boxed Processor