Cypress CY62158EV30 Benutzerhandbuch

®

Document #: 38-05578 Rev. *D

Page 11 of 11

®

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270329

See ECN

PCI

New Data Sheet

*A

291271

See ECN

SYT

Converted from Advance Information to Preliminary

Changed I

CCDR

 from 4 to 4.5 

µA 

*B

444306

See ECN

NXR

Converted from Preliminary to Final.

Removed 35 ns speed bin

Removed “L” bin.

Removed 44 pin TSOP II package

Included 48 pin TSOP I package

Changed the I

CC 

Typ value from 16 mA to 18 mA and I

CC 

max value from 28 

mA to 25 mA for test condition f = fax = 1/t

RC.

Changed the I

CC 

max value from 2.3 mA to 3 mA for test condition f = 1MHz. 

Changed the I

SB1 

and

 

I

SB2

 max value from 4.5 

µA to 8 µA and Typ value from 

0.9 

µA to 2 µA respectively.

Updated Thermal Resistance table

Changed Test Load Capacitance from 50 pF to 30 pF.

Added Typ value for I

CCDR .

Changed the I

CCDR 

max value from 4.5 

µA to 5 µA

Corrected t

R 

in Data Retention Characteristics from 100 

µs to t

RC 

ns

Changed t

LZOE

 from 3 to 5

Changed t

LZCE

 from 6 to 10

Changed t

HZCE

 from 22 to 18

Changed t

PWE

 from 30 to 35

Changed t

SD

 from 22 to 25

Changed t

LZWE

 from 6 to 10

Updated the ordering Information and replaced the Package Name column with 

Package Diagram.

*C

467052

See ECN

NXR

Included 44 pin TSOP II package in Product Offering.

Removed TSOP I package; Added reference to CY62157EV30 TSOP I 

Updated the ordering Information table

*D

1015643

See ECN

VKN

Added footnote #8 related to I

SB2

 and I

CCDR