Intel 317443-001US Benutzerhandbuch

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Intel
®
 945GME Express Chipset—About This Manual
Intel
®
 Core
TM
 2 Duo processor with the Mobile Intel
®
 945GME Express Chipset
Manual
May 2007
10
 
Order Number: 317443-001US
needed to ensure the setup time of the receiver. More precisely, 
flight time is defined as:
• The time difference between a signal at the input pin of a 
receiving agent crossing the switching voltage (adjusted to 
meet the receiver manufacturer’s conditions required for 
AC timing specifications; i.e., ringback, etc.) and the output 
pin of the driving agent crossing the switching voltage 
when the driver is driving a test load used to specify the 
driver’s AC timings.
• Maximum and Minimum Flight Time - Flight time variations 
are caused by many different parameters. The more 
obvious causes include variation of the board dielectric 
constant, changes in load condition, crosstalk, power noise, 
variation in termination resistance, and differences in I/O 
buffer performance as a function of temperature, voltage, 
and manufacturing process. Some less obvious causes 
include effects of Simultaneous Switching Output (SSO) 
and packaging effects.
• Maximum flight time is the largest acceptable flight time a 
network will experience under all conditions.
• Minimum flight time is the smallest acceptable flight time a 
network will experience under all conditions.
Infrared Data Assoc. The Infrared Data Association (IrDA) has outlined a specification 
for serial communication between two devices via a bi-
directional infrared data port. The 945GME platform has such a 
port and it is located on the rear of the platform between the two 
USB connectors.
IMVP6
The Intel Mobile Voltage Positioning specification for the Intel
®
 
Core™ 2 Duo Processor. It is a DC-DC converter module that 
supplies the required voltage and current to a single processor.
Inter-Symbol Interference
Inter-symbol interference is the effect of a previous signal (or 
transition) on the interconnect delay. For example, when a 
signal is transmitted down a line and the reflections due to the 
transition have not completely dissipated, the following data 
transition launched onto the bus is affected. ISI is dependent 
upon frequency, time delay of the line, and the reflection 
coefficient at the driver and receiver. ISI may impact both timing 
and signal integrity.
Media Expansion Card
The Media Expansion Card (MEC) provides digital display options 
through the SDVO interface. The MEC card also incorporates 
video-in.
Network
The network is the trace of a Printed Circuit Board (PCB) that 
completes an electrical connection between two or more 
components.
Overshoot
The maximum voltage observed for a signal at the device pad, 
measured with respect to VCC.
Pad
The electrical contact point of a semiconductor die to the 
package substrate. A pad is only observable in simulations.
Pin
The contact point of a component package to the traces on a 
substrate, such as the motherboard. Signal quality and timings 
may be measured at the pin.