Zhone Technologies ZTI-PG Benutzerhandbuch
A C C E S S F O R A C O N V E R G I N G W O R L D
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Bonding copper circuits for
increased Ethernet bandwidth
increased Ethernet bandwidth
The key innovation in EFM is the loop bonding of
multiple copper circuits to provide increased band-
width. By intelligently distributing traffic across
multiple circuits, and using very high-efficiency
hardware processing, these multiple circuits appear
to the network as a single, high-bandwidth link,
overcoming the limitations of individual copper
circuits.
multiple copper circuits to provide increased band-
width. By intelligently distributing traffic across
multiple circuits, and using very high-efficiency
hardware processing, these multiple circuits appear
to the network as a single, high-bandwidth link,
overcoming the limitations of individual copper
circuits.
802.3ah EFM
The IEEE 802.3ah standard for EFM, covering both
fiber and copper Ethernet applications, specifies the
type of encoding used, bonding methodology for
copper, and OAM (Operations, Administration and
Maintenance) support. Zhone supports 802.3ah in
our Ethernet aggregation line cards and EtherXtend
SHDSL.bis EAD products.
fiber and copper Ethernet applications, specifies the
type of encoding used, bonding methodology for
copper, and OAM (Operations, Administration and
Maintenance) support. Zhone supports 802.3ah in
our Ethernet aggregation line cards and EtherXtend
SHDSL.bis EAD products.
N2N Ethernet over Copper Bonding
Pioneered by Net to Net (also known as N2N,
acquired by Zhone in 2005) N2N Ethernet over copper
loop bonding is the pre-standard benchmark for
performance. Deployed worldwide and field proven,
Zhone continues its support for N2N bonding along
with standards-based EFM. N2N-based bonding
provides physical layer (PHY) bonding of T1 / E1 / DS3
and SHDSL circuits for highly efficient and reliable
bandwidth gain.
acquired by Zhone in 2005) N2N Ethernet over copper
loop bonding is the pre-standard benchmark for
performance. Deployed worldwide and field proven,
Zhone continues its support for N2N bonding along
with standards-based EFM. N2N-based bonding
provides physical layer (PHY) bonding of T1 / E1 / DS3
and SHDSL circuits for highly efficient and reliable
bandwidth gain.
Ethernet over Copper as Frame
Relay replacement
Relay replacement
IP SLA adds value
Today’s businesses need higher bandwidth and are
willing to pay for assured performance. IP Service
Level Agreement (IP SLA) enables the business
customer to receive reports on round trip performance,
link availability, link uptime, latency, jitter, and other
statistical data measurements for their service.
willing to pay for assured performance. IP Service
Level Agreement (IP SLA) enables the business
customer to receive reports on round trip performance,
link availability, link uptime, latency, jitter, and other
statistical data measurements for their service.
The advantage of Transparent LAN Service (TLS)
TLS uses the simplicity and ease of native Ethernet and
VLANs to deliver easy-to-provision Layer 2 services.
TLS provides seamless LAN-to-WAN connectivity,
without costly and complex WAN equipment or
the need to encapsulate. Up to 8 pairs of T1/E1 or
SHDSL.bis pairs can be bonded, thus providing
scalable bandwidth up to 45 Mbps.
VLANs to deliver easy-to-provision Layer 2 services.
TLS provides seamless LAN-to-WAN connectivity,
without costly and complex WAN equipment or
the need to encapsulate. Up to 8 pairs of T1/E1 or
SHDSL.bis pairs can be bonded, thus providing
scalable bandwidth up to 45 Mbps.
Ethernet Private Line services are quick and easy
Creating a point-to-point Ethernet Private Line
(E-Line) service using existing copper pairs allows
copper bonding to rapidly increase bandwidth by
creating T1/E1 or SHDSL.bis Ethernet connections
from 1.5 Mbps to as high as 45 Mbps. Using the same
copper delivering Fractional or Full T-1 Frame Relay,
a secure and higher bandwidth E-Line is created
without the need to reconfigure the core network.
(E-Line) service using existing copper pairs allows
copper bonding to rapidly increase bandwidth by
creating T1/E1 or SHDSL.bis Ethernet connections
from 1.5 Mbps to as high as 45 Mbps. Using the same
copper delivering Fractional or Full T-1 Frame Relay,
a secure and higher bandwidth E-Line is created
without the need to reconfigure the core network.
IP Core
“Book-ended”
EFM over Copp
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Aggregated