Intel 820E Benutzerhandbuch

Intel

Intel

®

820E Chipset

R

Design Guide

11

Table 45. USB........................................................................................................................ 134

Table 46. LAN Connect I/F..................................................................................................... 135

Table 47. AC’97 ..................................................................................................................... 136

Table 48. ICH2 Decoupling .................................................................................................... 136

Table 49. CK-SKS Clocking................................................................................................... 137

Table 50. RTC........................................................................................................................ 137

Table 51. AGTL+ Parameters for Example Calculations

.................................................... 143

Table 52. Example T

Calculations for 133 MHz Bus

.................................................. 144

Table 53. Example T

(Frequency Independent)..................................... 145

Table 54. Trace Width Space Guidelines .............................................................................. 148

Table 55. Intel

820E Chipset Platform System Clocks......................................................... 163

Table 56. Intel

820E Chipset Platform Clock Skews ............................................................ 165

Table 57. Intel

820E Chipset Platform System Clock Cross-Reference .............................. 167

Table 58. Placement Guidelines for Motherboard Routing Lengths (Direct RDRAM*

Clock Routing Length Guidelines) .......................................................................... 170

Table 59. External DRCG Component Values....................................................................... 172

Table 60. Unused Output Termination................................................................................... 174

Stack-Up Examples....................................................................................... 179

Table 62. 3D Field Solver vs. ZCALC .................................................................................... 180

Table 63. Intel

820E Chipset Component Thermal Design Power....................................... 193

Table 64. Glue Chip Vendors................................................................................................. 194