Intel 820E Benutzerhandbuch

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Intel
®
 820E Chipset 
 
 
 
 
R
 
114  
Design 
Guide 
2.22.3.5. Critical 
Dimensions 
As shown in the following figure, there are three dimensions to consider during layout: Distance B, from 
the line RJ11 connector to the magnetics module; distance C, from the phone RJ11 to the LPF (if 
implemented); and distance A, from the Intel
 
82562EH component to the magnetics module. 
Figure 71. Critical Dimensions for Component Placement
 
 
IO_subsys_crit_dim_comp_plac
ICH2
 
Intel®
82562EH
 
Magnetics
 
module
 
Line
 
RJ11
 
B
A
EEPROM
 
LPF
 
Phone
 
RJ11
 
C
 
 
 
Distance Priority Guideline 
B 1 
<1 
inch 
A 2 
<1 
inch 
C 3 
<1 
inch 
2.22.3.5.1.  Distance from Magnetics Module to Line RJ11 
Distance B should be given highest priority and should be less then 1 inch. Regarding trace symmetry, 
route differential pairs with consistent separation and with exactly the same lengths and physical 
dimensions. 
Asymmetry and unequal length in differential pairs contribute to common-mode noise. This can degrade 
the receive-circuit performance and contribute to radiated emissions from the transmit side. 
2.22.3.5.2.  Distance from Intel
®
 82562EH Component to Magnetics Module 
Due to the high speed of signals present, distance ‘A’ between the Intel
 
82562EH component and the 
magnetics also should be less than 1 inch, but it should be second priority relative to the distance from 
the connects to the magnetics module. 
In general, any trace section intended for use with high-speed signals should comply with the proper 
termination practices. Proper signal termination can reduce reflections caused by impedance mismatches 
between devices and trace routes. A signal’s reflection may contain a high-frequency component that 
may contribute more EMI than the original signal itself.