Intel 820E Benutzerhandbuch

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Intel
®
 820E Chipset 
 
 
 
 
R
 
48  
Design 
Guide 
The copper tab area for the recommended stack-up was determined by means of simulation. The amount 
of capacitance required is determined by the layer on which the RSL or clocking signal is routed. The 
copper tabs can be placed on any signal layer, independently of the layer on which the RSL signal is 
routed.  
The following example calculation uses Equation 1. Approximate Copper Tab Area Calculation for a 
board with an 
ε
r
 of 4.2 and a prepreg thickness of 4.5 mils. Note that these numbers vary with the 
difference in prepreg thickness. 
Table 6. Copper Tab Area Calculation 
Layer Dielectric 
Thickness 
Separation 
Between 
Signal Traces 
& Copper Tab 
Min. 
Ground 
Flood 
Air Gap 
between 
Signal & 
GND Flood 
Compensating 
Capacitance in 
Cplate (pF) 
CTAB Area 
(sq. mils) 
Top 
4.5 
10 
0.65 – 0.85 
~2810 – 3680 
Bottom 
4.5 
10 
1.20 – 1.40 
~5194 – 6060 
Note that more than one copper tab shape may be used, as shown in Figure 26. The dimensions are based 
on the copper area over the ground plane. The actual length and width of the tabs may differ due to 
routing constraints (e.g., if tab must extend to center of hole or anti-pad). Figures 26 through 28 show a 
tab compensation capacitor routing example. Note that the capacitor tabs must not interrupt ground 
floods around the RIMM pins, and they must be connected, to avoid discontinuity in the ground plane, as 
shown. 
Figure 26. Top-Layer CTAB with RSL Signal Routed on the Same Layer (C
EFF
 = 0.8 pF) 
 
Figure 27. Bottom-Layer CTAB with RSL Signal Routed on the Same Layer (C
EFF
 = 1.35 pF)