Intel 945P Benutzerhandbuch
Thermal Metrology
16
Thermal and Mechanical Design Guidelines
Figure 2. 0° Angle Attach Methodology (top view, not to scale)
Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom
view shown, not to scale)
3.2
Airflow Characterization
Figure 4 describes the recommended location for air temperature measurements
measured relative to the component. For a more accurate measurement of the
average approach air temperature, Intel recommends averaging temperatures
recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for
both a single thermocouple and a pair of thermocouples are presented.