Intel 945P Benutzerhandbuch

Introduction

Thermal and Mechanical Design Guidelines

Introduction

As the complexity of computer systems increases, so do power dissipation

requirements. The additional power of next generation systems must be properly

dissipated. Heat can be dissipated using improved system cooling, selective use of

ducting, and/or active/passive heatsinks.

The objective of thermal management is to ensure that the temperatures of all

components in a system are maintained within functional limits. The functional

temperature limit is the range within which the electrical circuits can be expected to

meet specified performance requirements. Operation outside the functional limit can

degrade system performance, cause logic errors, or cause component and/or system

damage. Temperatures exceeding the maximum operating limits may result in

irreversible changes in the operating characteristics of the component. The goal of this

document is to provide an understanding of the operating limits of the Intel

82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and Intel

82945P/82945PL Memory Controller Hub (MCH), and discuss a reference thermal

solution.

The simplest and most cost-effective method to improve the inherent system cooling

characteristics of the (G)MCH is through careful design and placement of fans, vents,

and ducts. When additional cooling is required, component thermal solutions may be

implemented in conjunction with system thermal solutions. The size of the fan or

heatsink can be varied to balance size and space constraints with acoustic noise.

This document presents the conditions and requirements to properly design a cooling

solution for systems that implement the 82945G/82945GZ/82945GC GMCH or

82945P/82945PL MCH. Properly designed solutions provide adequate cooling to

maintain the (G)MCH case temperature at or below thermal specifications. This is

accomplished by providing a low local-ambient temperature, ensuring adequate local

airflow, and minimizing the case to local-ambient thermal resistance. By maintaining

the (G)MCH case temperature at or below those recommended in this document, a

system designer can ensure the proper functionality, performance, and reliability of

these components.

Note: Unless otherwise specified, the information in this document applies to the Intel

82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and the
Intel

82945P/82945PL Memory Controller Hub (MCH). The term (G)MCH refers to the

82945G GMCH, 82945GZ GMCH, 82945GC GMCH, 82945P MCH, and 82945PL MCH.

Note: Unless otherwise specified, ICH7 refers to the Intel

82801GB ICH7 and 82801GR

ICH7R I/O Controller Hub 7 components.