Infocus IN24 Zusätzliches Handbuch
ATTACHMENT: Current RoHS Exemptions
Current RoHS Exemptions include, but are not limited to the following:
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp
2a. Mercury in straight fluorescent lamps for general purposes not exceeding 10 mg. in
halophosphate lamps
2b. Mercury in straight fluorescent lamps for general purposes not exceeding 5 mg. in
triphosphate lamps with a normal lifetime
2c. Mercury in straight fluorescent lamps for general purposes not exceeding 8 mg
triphosphate lamps with long lifetime.
3. Mercury in straight fluorescent lamps for special purposes
4. Mercury in other lamps not specifically mentioned in this list
5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes
6a. Lead as an alloying element in steel containing up to 0.35% lead by weight
6b. Lead as an alloying element in aluminum containing up to 0.4% lead by weight
6c. Lead as an alloying element in copper containing up to 4% lead by weight
7a. Lead in high melting temperature type solders (i.e. lead based solder alloys
containing 85% by weight or more lead)
7b. Lead in solders for servers, storage and storage array systems, network infrastructure
equipment for switching, signaling, transmission as well as network management for
telecommunications
7c. Lead in electronic ceramic items (e.g. piezoelectronic devices)
8. Cadmium and its compounds in electrical contacts and cadmium plating except for
applications banned under Directive 91/338/EEC amending Directive 76/769/EEC
relating to restrictions on the marketing and use of certain dangerous substances and
preparations (piezoelectronic devices)
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in
absorption refrigerators
10a. Deca BDE in polymeric applications
10b. Lead in lead/bronze bearing shells and bushes
11. Lead used in compliant pin connector systems
12. Lead as a coating material for a thermal conduction module c-ring
13a. Lead in optical and filter glass
13b. Cadmium in optical and filter glass
14. Lead in solders consisting of more than two elements for the connection between the
pins and the package of microprocessors with a lead content of more than 80% and less
than 85% by weight
15. Lead in solders to complete a viable electrical connection between semiconductor
die and carrier within integrated circuit Flip Chip packages
Current RoHS Exemptions include, but are not limited to the following:
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp
2a. Mercury in straight fluorescent lamps for general purposes not exceeding 10 mg. in
halophosphate lamps
2b. Mercury in straight fluorescent lamps for general purposes not exceeding 5 mg. in
triphosphate lamps with a normal lifetime
2c. Mercury in straight fluorescent lamps for general purposes not exceeding 8 mg
triphosphate lamps with long lifetime.
3. Mercury in straight fluorescent lamps for special purposes
4. Mercury in other lamps not specifically mentioned in this list
5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes
6a. Lead as an alloying element in steel containing up to 0.35% lead by weight
6b. Lead as an alloying element in aluminum containing up to 0.4% lead by weight
6c. Lead as an alloying element in copper containing up to 4% lead by weight
7a. Lead in high melting temperature type solders (i.e. lead based solder alloys
containing 85% by weight or more lead)
7b. Lead in solders for servers, storage and storage array systems, network infrastructure
equipment for switching, signaling, transmission as well as network management for
telecommunications
7c. Lead in electronic ceramic items (e.g. piezoelectronic devices)
8. Cadmium and its compounds in electrical contacts and cadmium plating except for
applications banned under Directive 91/338/EEC amending Directive 76/769/EEC
relating to restrictions on the marketing and use of certain dangerous substances and
preparations (piezoelectronic devices)
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in
absorption refrigerators
10a. Deca BDE in polymeric applications
10b. Lead in lead/bronze bearing shells and bushes
11. Lead used in compliant pin connector systems
12. Lead as a coating material for a thermal conduction module c-ring
13a. Lead in optical and filter glass
13b. Cadmium in optical and filter glass
14. Lead in solders consisting of more than two elements for the connection between the
pins and the package of microprocessors with a lead content of more than 80% and less
than 85% by weight
15. Lead in solders to complete a viable electrical connection between semiconductor
die and carrier within integrated circuit Flip Chip packages
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