Intel SU2300 AV80577UG0091ML Datenbogen

Intel

Produktcode

AV80577UG0091ML

Datasheet

1

Introduction ..............................................................................................................7
1.1

Terminology .......................................................................................................8

References .........................................................................................................9

Low Power Features ................................................................................................ 11
2.1

Clock Control and Low Power States .................................................................... 11
2.1.1

Core Low-Power States ........................................................................... 12
2.1.1.1

C0 State .................................................................................. 12

C1/AutoHALT Powerdown State .................................................. 12

C1/MWAIT Powerdown State ...................................................... 13

Core C2 State........................................................................... 13

Core C3 State........................................................................... 13

Core C4 State........................................................................... 13

Package Low-Power States ...................................................................... 13
2.1.2.1

Normal State............................................................................ 13

Stop-Grant State ...................................................................... 13

Stop Grant Snoop State ............................................................. 14

Sleep State .............................................................................. 14

Deep Sleep State ...................................................................... 15

Deeper Sleep State ................................................................... 15

Enhanced Intel SpeedStep® Technology .............................................................. 15

Low-Power FSB Features .................................................................................... 16

Processor Power Status Indicator (PSI#) Signal..................................................... 17

Electrical Specifications ........................................................................................... 19
3.1

Power and Ground Pins ...................................................................................... 19

FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 19

Voltage Identification ......................................................................................... 19

Catastrophic Thermal Protection .......................................................................... 22

Reserved and Unused Pins.................................................................................. 22

FSB Frequency Select Signals (BSEL[2:0])............................................................ 23

FSB Signal Groups............................................................................................. 23

CMOS Signals ................................................................................................... 25

Maximum Ratings.............................................................................................. 25

3.10 Processor DC Specifications ................................................................................ 26

Package Mechanical Specifications and Pin Information .......................................... 33
4.1

Package Mechanical Specifications ....................................................................... 33

Processor Pinout and Pin List .............................................................................. 39

Alphabetical Signals Reference ............................................................................ 75

Thermal Specifications and Design Considerations .................................................. 83
5.1

Monitoring Die Temperature ............................................................................... 84
5.1.1

Thermal Diode ....................................................................................... 85

Thermal Diode Offset .............................................................................. 87

Intel® Thermal Monitor........................................................................... 88

Digital Thermal Sensor............................................................................ 89

Out of Specification Detection .................................................................. 90

PROCHOT# Signal Pin ............................................................................. 90