Intel LF80550KG0804M Datenbogen
Dual-Core Intel® Xeon® Processor 7100 Series Datasheet
45
Mechanical Specifications
3.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or pin-side of the package substrate. See
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or pin-side of the package substrate. See
for keepout
zones.
3.3
Package Loading Specifications
provides dynamic and static load specifications for the processor package.
These mechanical load limits should not be exceeded during heatsink assembly,
shipping conditions, or standard use condition. Also, any mechanical system or
component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solutions. The minimum loading specification must be
maintained by any thermal and mechanical solution.
shipping conditions, or standard use condition. Also, any mechanical system or
component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solutions. The minimum loading specification must be
maintained by any thermal and mechanical solution.
Notes:
1.
These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2.
This is the minimum and maximum static force that can be applied by the heatsink and retention solution
to maintain the heatsink and processor interface.
3.
These parameters are based on limited testing for design characterization. Loading limits are for the
package only and do not include the limits of the processor socket.
4.
This specification applies for thermal retention solutions that allow baseboard deflection.
5.
This specification applies either for thermal retention solutions that prevent baseboard deflection or for the
Intel enabled reference solution (CEK).
6.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
7.
Experimentally validated test condition used a heatsink mass of 1 lbm (~0.45 kg) with 100 G acceleration
measured at heatsink mass. The dynamic portion of this specification in the product application can have
flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this
validated dynamic load (1 lbm x 100 G = 100 lb).
8.
Transient loading is defined as a 2 second duration peak load superimposed on the static load requirement,
representative of loads experienced by the package during heatsink installation.
Table 3-1.
Processor Loading Specifications
Parameter
Minimum
Maximum
Unit
Notes
Static Compressive
Load
44
10
222
50
N
lbf
1, 2, 3, 4
44
10
288
65
N
lbf
1, 2, 3, 5
Dynamic
Compressive Load
222 N + 0.45 kg * 100 G
50 lbf (static) + 1 lbm * 100 G
N
lbf
1, 3, 4, 6, 7
288 N + 0.45 kg * 100 G
65 lbf (static) + 1 lbm * 100 G
N
lbf
1, 3, 5, 6, 7
Transient
445
100
N
lbf
1, 3, 8