Apple emac ati usb2 2005 Servicehandbuch
eMac ATI Graphics /USB 2.0/2005 Troubleshooting -
23
General Information
Thermal Paste Application
The microprocessor uses a heatsink/thermal pipe to transfer heat away. Whenever the heatsink is removed,
the bottom side of the heatsink and the top of the microprocessor must be cleaned and thermal paste must
be applied. If the mating surfaces are not cleaned and thermal paste is not applied, the CPU may overheat
and become damaged.
Tools
This procedure requires the following tools:
• Plastic stylus or nylon probe tool (922-5065) to remove the old thermal paste
• Thermal paste (922-4757), each tube contains 4-5 applications
Procedure
1.
Thoroughly clean the thermal film from the heatsink surface with a plastic stylus or the nylon probe tool.
Do not use an abrasive material or liquid cleaner.
Important:
Be extremely careful not to bend the fins
on the heatsink.