HP kp721av Benutzerhandbuch
Technical Reference Guide
www.hp.com
7-1
7
Power and Signal Distribution
7.1 Introduction
This chapter describes the power supplies and discusses the methods of general power and signal
distribution. Topics covered in this chapter include:
distribution. Topics covered in this chapter include:
■
Power distribution (7.2)
■
Power Control (7.3)
■
Signal distribution (7.4)
7.2 Power
Distribution
Each form factor uses a unique power supply assembly and implements different methods of
power generation and distribution. The USDT form factor uses an external (“brick”) supply
while the SFF and CMT form factors use a power supply unit contained within the system
chassis. The subassemblies are not interchangeable between the three form factors.
power generation and distribution. The USDT form factor uses an external (“brick”) supply
while the SFF and CMT form factors use a power supply unit contained within the system
chassis. The subassemblies are not interchangeable between the three form factors.
7.2.1 USDT Power Distribution
The USDT form factor uses an external (“brick”) supply that connects to the chassis through a
three-conductor cable (Figure 7-1). All voltages required by the processing circuits, peripherals,
and storage devices are produced on the system board from the 19.5 VDC produced by the
external power supply assembly. The external power supply always produces 19.5 VDC as long
as it is connected to an active AC outlet.
three-conductor cable (Figure 7-1). All voltages required by the processing circuits, peripherals,
and storage devices are produced on the system board from the 19.5 VDC produced by the
external power supply assembly. The external power supply always produces 19.5 VDC as long
as it is connected to an active AC outlet.
Figure 7-1. USDT Power Generation, Block Diagram
System Board
Power Supply
Power On
Power Logic,
Front Bezel
Voltage Regulators
Unit
Power Button
+19.5
USDT Chassis
90 - 264 VAC
Rtn
Pwr rating
& ID
& ID
VDC
External