HP omnibook 800 Servicehandbuch
68
Heat Transfer Disk
(The following information applies to F1360 units only.)
With each replacement of the CPU, a new Heat Transfer Disk must be placed on the underside
of the Top Case. See Figure 38. Simply pull back the Keyboard Support Insulator, remove the
old Heat Transfer Disk, center the new Heat Transfer Disk in the indentation and reposition the
Insulator. Ensure the rectangle opening in the Insulator is positioned squarely over the Heat
Transfer Disk so that the edges of the Insulator opening retain the disk.
of the Top Case. See Figure 38. Simply pull back the Keyboard Support Insulator, remove the
old Heat Transfer Disk, center the new Heat Transfer Disk in the indentation and reposition the
Insulator. Ensure the rectangle opening in the Insulator is positioned squarely over the Heat
Transfer Disk so that the edges of the Insulator opening retain the disk.
The heat generated by the CPU must be transferred through the CPU Thermal Coupling to the
Heat Transfer Disk. See Figure 39. The material used to facilitate the heat transfer is a paraffin-
based thermally conductive wax. When heated, the wax on the disk melts and flows to fill in
thermally restrictive air gaps between the Top Case and the CPU.
Heat Transfer Disk. See Figure 39. The material used to facilitate the heat transfer is a paraffin-
based thermally conductive wax. When heated, the wax on the disk melts and flows to fill in
thermally restrictive air gaps between the Top Case and the CPU.
Figure 38 - Heat Transfer Disk and Keyboard Support Insulator
Figure 39 - CPU Thermal
Coupling
Coupling
Keyboard Support Insulator
(p/n F1360-20004)
(p/n F1360-20004)
CPU Thermal Coupling
Heat Transfer Disk
(p/n F1360-20006)
(p/n F1360-20006)