Intel X5680 AT80614005124AA Benutzerhandbuch
Produktcode
AT80614005124AA
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
33
Electrical Specifications
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processors.
2. Individual processor VID and/or VTT_VID values may be calibrated during manufacturing such that two
devices at the same speed may have different settings.
3. These voltages are targets only. A variable voltage source should exist on systems in the event that a
different voltage is required.
4. The V
CC
voltage specification requirements are measured across vias on the platform for the VCCSENSE and
VSSSENSE pins close to the socket with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe
capacitance, and 1 M minimum impedance. The maximum length of ground wire on the probe should be
less than 5 mm. Ensure external noise from the system is not coupled in the scope probe.
5. The V
TT
voltage specification requirements are measured across vias on the platform for the VTTD_SENSE
and VSS_SENSE_VTTD lands close to the socket with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum
probe capacitance, and 1 M minimum impedance. The maximum length of ground wire on the probe should
be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe.
6. Refer to
and corresponding
. The processor should not be subjected to any static V
CC
level that exceeds the V
CC_MAX
associated with any particular current. Failure to adhere to this specification
can shorten processor lifetime.
7. Minimum V
CC
and maximum I
CC
are specified at the maximum processor case temperature (T
CASE
) shown in
. I
CC_MAX
is specified at the relative V
CC_MAX
point on the V
CC
load line. The processor is capable of
drawing I
CC_MAX
for up to 10 ms. Refer to
through
for further details on the average
processor current draw over various time durations.
8. Refer to
and corresponding
. The processor should not be subjected to any static V
TT
level that exceeds the V
TT_MAX
associated with any particular current. Failure to adhere to this specification
can shorten processor lifetime.
9. This specification represents the V
CC
reduction due to each VID transition. See
. AC timing
requirements for VID transitions are included in
10.Baseboard bandwidth is limited to 20 MHz.
11.FMB is the flexible motherboard guidelines. See
for FMB details.
12.ICC_TDC (Thermal Design Current) is the sustained (DC equivalent) current that the processor is capable of
drawing indefinitely and should be used for the voltage regulator temperature assessment. The voltage
regulator is responsible for monitoring its temperature and asserting the necessary signal to inform the
processor of a thermal excursion.
I
CC_TDC
I
CCPLL_TDC
I
DDQ_TDC
I
TT_TDC
Thermal Design
Current:
Frequency Optimized
Frequency Optimized
Server/Workstation
(TDP = 130 W)
(Launch - FMB)
(TDP = 130 W)
(Launch - FMB)
V
CC
V
CCPLL
V
DDQ
V
TTA
V
TTD
110
1.1
9
6
6
22
A
A
A
A
A
A
A
A
A
11,12
Thermal Design
Current:
Advanced
Server/Workstation
(TDP = 95 W)
(Launch - FMB)
(Launch - FMB)
V
CC
V
CCPLL
V
DDQ
V
TTA
V
TTD
101
1.1
9
6
6
22
A
A
A
A
A
A
A
A
A
11,12
Thermal Design
Current:
Standard
Server/Workstation
(TDP = 80 W)
(Launch - FMB)
(Launch - FMB)
V
CC
V
CCPLL
V
DDQ
V
TTA
V
TTD
70
1.1
9
6
6
22
A
A
A
A
A
A
A
A
A
11,12
Thermal Design
Current:
Low Power & LV-60W
(TDP = 60 W)
(Launch - FMB)
(Launch - FMB)
V
CC
V
CCPLL
V
DDQ
V
TTA
V
TTD
60
1.1
9
6
6
20
A
A
A
A
A
A
A
A
A
11,12
Thermal Design
Current:
Low Power & LV-40W
(TDP = 40 W)
(Launch - FMB)
(Launch - FMB)
V
CC
V
CCPLL
V
DDQ
V
TTA
V
TTD
40
1.1
9
6
6
20
A
A
A
A
A
A
A
A
A
11,12
I
DDQ_S3
DDR3 System Memory
Interface Supply
Current in Standby
State
V
DDQ
1
A
13,14
Table 2-8.
Voltage and Current Specifications (Sheet 2 of 2)
Symbol
Parameter
Voltage
Plane
Min
Typ
Max
Unit
Notes
1