FIC a440 Servicehandbuch
Hardware Functional Overview
FIC A440 Series Service Manual
4-1
Chapter
4
4.1
4.1
4.1
4.1 Overview
Overview
Overview
Overview
The FIC A440 Series consist of several major functions and subsystems (see Figure 4-1)
including:
including:
• System Processor – implemented on the motherboard using Intel Pentium-III or
Mobile Celeron with Socket 370 FC-PGA packaging at 100MHz system bus speed.
• System North Bridge Core Logic – implemented on the motherboard using the VIA
ProMedia VT8601 chipset which integrates the following:
- Trident CyberBladei1 AGP 3D Graphics Accelerator
- Advanced System Memory Controller
- Advanced System Memory Controller
• System South Bridge Core Logic – implemented on the motherboard using the VIA
VT82686A PCI-to-ISA chipset which integrates the following:
- Enhanced IDE Interface for HDD, CD-ROM, and IDE Device Bay
- SoundBlaster/DirectSound AC97 Digital Audio Controller
- USB Interface for the external USB port
- Super
- SoundBlaster/DirectSound AC97 Digital Audio Controller
- USB Interface for the external USB port
- Super
I/O
• Clock Frequency Generator – implemented on the motherboard using the ICWork
W156 clock generator chip.
• Cache Memory Subsystem – implemented on-die on the Intel Mobile CPU.
• Video Subsystem – integrated on the VIA VT8601 North Bridge chip using Trident
• Video Subsystem – integrated on the VIA VT8601 North Bridge chip using Trident
CyberBladei1 and on the LCD Panel for supporting the LCD and CRT.
• PCMCIA Subsystem – implemented on the motherboard using the Texas Instrument
(TI) 1225 PCMCIA controller chip.
• Audio Subsystem – integrated on the VIA South Bridge chip.
• Keyboard and Pointing Device Subsystem – implemented on the AIO board, the
• Keyboard and Pointing Device Subsystem – implemented on the AIO board, the
Keyboard assembly, and the Glidepad assembly.
• I/O Subsystem – integrated on the VIA South Bridge chip.
• LAN and Modem Feature Card – implemented on the motherboard via the mini-PCI
• LAN and Modem Feature Card – implemented on the motherboard via the mini-PCI
bus module socket.
• Port Bar – implemented on the motherboard and the Port Bar assembly.
• Power Subsystem – implemented on the DC-DC board, LCD Inverter Board, Battery
• Power Subsystem – implemented on the DC-DC board, LCD Inverter Board, Battery
Pack, and AC adapter.
• Micro-P Subsystem – implemented on the motherboard using PIC 16C62A.