Trimble Outdoors 58052-00 Benutzerhandbuch
Copernicus GPS Receiver 8 1
MECHANICAL SPECIFICATIONS 7
Paste Mask
To ensure good mechanical bonding with sufficient solder to form a castellation
solder joint, use a solder mask ratio of 1:1 with the solder pad. When using a 5 ±1 Mil
stencil to deposit the solder paste, we recommend a 4 Mil toe extension on the stencil.
The units in brackets, [ ], are in millimeters.
solder joint, use a solder mask ratio of 1:1 with the solder pad. When using a 5 ±1 Mil
stencil to deposit the solder paste, we recommend a 4 Mil toe extension on the stencil.
The units in brackets, [ ], are in millimeters.
Figure 7.5
Paste Mask Diagram