jetway 815eda1a Benutzerhandbuch
1
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO
THE
MANUFACTURER
. NO PART OF THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR
BY ANY MEANS WITHOUT WRITTEN PERMISSION OF
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR
BY ANY MEANS WITHOUT WRITTEN PERMISSION OF
THE MANUFACTURER
.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD
AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE,
CORRECT ANY TIME WITHOUT NOTICE.
AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE,
CORRECT ANY TIME WITHOUT NOTICE.
MANUFACTURER
PROVIDES THIS MANUAL “AS IS”
WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT,
SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF
PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE
LIKE).
SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF
PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE
LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S
BENEFIT, WITHOUT INTENT TO INFRINGE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S
BENEFIT, WITHOUT INTENT TO INFRINGE
Manual Revision Information
Reversion
Revision History
Date
1.0
First Release
July 2002
Item Checklist
5
Motherboard
5
Cable for IDE/Floppy
5
CD for motherboard utilities
□
Cable for USB Port 3/4 (Option)
5
Cable for COM2 (Option)
5
User’s Manual
Intel Processor Family
Thermal Solutions
As processor technology pushes to faster speeds and higher performance, thermal management
becomes increasingly crucial when building computer systems. Maintaining the proper thermal
environment is key to reliable, long-term system operation. The overall goal in providing the proper
thermal environment is keeping the processor below its specified maximum case temperature.
Heatsinks induce improved processor heat dissipation through increased surface area and
concentrated airflow from attached fans. In addition, interface materials allow effective transfers of
heat from the processor to the heatsink. For optimum heat transfer, Intel recommends the use of
thermal grease and mounting clips to attach the heatsink to the processor.
becomes increasingly crucial when building computer systems. Maintaining the proper thermal
environment is key to reliable, long-term system operation. The overall goal in providing the proper
thermal environment is keeping the processor below its specified maximum case temperature.
Heatsinks induce improved processor heat dissipation through increased surface area and
concentrated airflow from attached fans. In addition, interface materials allow effective transfers of
heat from the processor to the heatsink. For optimum heat transfer, Intel recommends the use of
thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below for collection of
heatsinks evaluated and recommended by Intel for use with Intel processors.
Vendor list for heatsink and fan of Pentium® III processor, please visit：
http://developer.intel.com/design/Pentiumiii/components/index.htm
Vendor list for heatsink and fan of Intel® Celeron™ processor, please visit：
http://developer.intel.com/design/celeron/components/index.htm
heatsinks evaluated and recommended by Intel for use with Intel processors.
Vendor list for heatsink and fan of Pentium® III processor, please visit：
http://developer.intel.com/design/Pentiumiii/components/index.htm
Vendor list for heatsink and fan of Intel® Celeron™ processor, please visit：
http://developer.intel.com/design/celeron/components/index.htm