Quectel Wireless Solutions Company Limited 201807EG95NA Benutzerhandbuch

LTE Module Series

EG95 Hardware Design

EG95_Hardware_Design 8 / 81

FIGURE 38: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 57

FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 66

FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BOTTOM OF CUSTOMERS’ PCB) . 67

FIGURE 41: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 68

FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 69

FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 70

FIGURE 44: TOP VIEW OF THE MODULE ...................................................................................................... 71

FIGURE 45: BOTTOM VIEW OF THE MODULE .............................................................................................. 71

FIGURE 46: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 73

FIGURE 47: TAPE DIMENSIONS ..................................................................................................................... 74

FIGURE 48: REEL DIMENSIONS ..................................................................................................................... 74