Ezurio Ltd 08B Benutzerhandbuch
www.EZURiO.com
DSH_BTM402_0v72 BISM2 PA Data Sheet.DOC
© 2007 EZURiO Ltd
1
Long Range Bluetooth™ Serial Module
Bluetooth Module with Power Amplifier
Part Number: BTM402
1. General Description
EZURiO’s BISM II PA Bluetooth Serial Module is a fully integrated and qualified Class 1 Bluetooth
solution, which incorporates a power amplifier and low noise amplifier that maximises the RF link
budget to provide the greatest range of any Bluetooth Module. The module is designed for lowest cost
of integration and ownership for designers wishing to incorporate Bluetooth functionality into their
products. The module is qualified to Bluetooth Version 2.0.
solution, which incorporates a power amplifier and low noise amplifier that maximises the RF link
budget to provide the greatest range of any Bluetooth Module. The module is designed for lowest cost
of integration and ownership for designers wishing to incorporate Bluetooth functionality into their
products. The module is qualified to Bluetooth Version 2.0.
The BISM II PA Bluetooth Serial Module is one of the most compact complete Bluetooth solutions,
making it ideal to integrate into handheld devices. The module includes a high sensitivity, high gain
antenna which provides excellent range. Typical open field performance provides ranges of up to
1,000 metres at transmit powers of 80mW.
making it ideal to integrate into handheld devices. The module includes a high sensitivity, high gain
antenna which provides excellent range. Typical open field performance provides ranges of up to
1,000 metres at transmit powers of 80mW.
The BISM II PA Module is based on Cambridge Silicon Radio’s BlueCore 04 chipset. The module
contain all of the hardware and firmware for a complete Bluetooth solution, requiring no further
components. The Module has an integrated, high performance antenna which is matched with the
Bluetooth RF and baseband circuitry. The firmware integrated into the BC04 chipset implements the
higher layer Bluetooth protocol stack, with support for applications requiring Generic Access Profile
(GAP), Service Discovery Profile (SDAP), Serial Port Profile (SPP), Dial Up Networking Profile (DUN),
Headset Profile (HSP), Hands Free Profile (HFP), File Transfer Profile (FTP) and OBEX (Client).
contain all of the hardware and firmware for a complete Bluetooth solution, requiring no further
components. The Module has an integrated, high performance antenna which is matched with the
Bluetooth RF and baseband circuitry. The firmware integrated into the BC04 chipset implements the
higher layer Bluetooth protocol stack, with support for applications requiring Generic Access Profile
(GAP), Service Discovery Profile (SDAP), Serial Port Profile (SPP), Dial Up Networking Profile (DUN),
Headset Profile (HSP), Hands Free Profile (HFP), File Transfer Profile (FTP) and OBEX (Client).
A virtual processor is used within the BC04 to implement an AT command processor. This interfaces
to the host system over a straight forward serial port using an extensive range of AT commands. The
AT command set abstracts the Bluetooth protocol from the host application, saving many months of
programming and integration time. It provides extremely short integration times for data oriented
cable replacement and voice applications. Firmware is also included that provides programming
support for multi-point applications. A low cost development system is available for fast product
evaluation and development.
to the host system over a straight forward serial port using an extensive range of AT commands. The
AT command set abstracts the Bluetooth protocol from the host application, saving many months of
programming and integration time. It provides extremely short integration times for data oriented
cable replacement and voice applications. Firmware is also included that provides programming
support for multi-point applications. A low cost development system is available for fast product
evaluation and development.
Support is provided for low power modes that make the BISM II PA particularly applicable to battery
powered installations.
powered installations.
The Module can be configured so that it can be attached to a ‘dumb’ terminal or attached to a PC or
PDA for cable replacement applications.
PDA for cable replacement applications.
In addition to the Bluetooth functionality, The BISM II PA Module provides access to 9 General I/O
lines and 2 analogue input lines. These can be configured to provide connection to simple devices
such as switches or LEDs without requiring any external processor. Both the GPIO and ADC lines can
be accessed either via the wired host UART connection, or remotely over the Bluetooth link.
lines and 2 analogue input lines. These can be configured to provide connection to simple devices
such as switches or LEDs without requiring any external processor. Both the GPIO and ADC lines can
be accessed either via the wired host UART connection, or remotely over the Bluetooth link.
The BISM II PA module is supplied in a small form factor pcb (22.0mm x 34.0mm x 7.6mm), that
connects to a main pcb using a 40 way Hirose connector. The interface is compatible with the BISM1
module and EZURiO’s 40 pin 802.11 modules. The BISM II PA module is Lead-free and is RoHS
compliant and supports an industrial temperature range of -20°C to +85°C.
connects to a main pcb using a 40 way Hirose connector. The interface is compatible with the BISM1
module and EZURiO’s 40 pin 802.11 modules. The BISM II PA module is Lead-free and is RoHS
compliant and supports an industrial temperature range of -20°C to +85°C.
A key feature of the design is that the module is pin and format compatible with EZURiO’s range of
802.11 wireless LAN modules. This allows designers to manufacture a single version of pcb which can
accept either a Bluetooth or an 802.11 module, greatly reducing development time to generate a
range of wirelessly enabled products. The compatible 802.11 modules are the WISMC01, which
contains a full TCP/IP stack, network drivers and a web server, and the WISMC02 which contains
wireless network drivers and a UDP stack with SLIP interface.
802.11 wireless LAN modules. This allows designers to manufacture a single version of pcb which can
accept either a Bluetooth or an 802.11 module, greatly reducing development time to generate a
range of wirelessly enabled products. The compatible 802.11 modules are the WISMC01, which
contains a full TCP/IP stack, network drivers and a web server, and the WISMC02 which contains
wireless network drivers and a UDP stack with SLIP interface.