Gemalto M2M GmbH ELS61-USA Benutzerhandbuch
Cinterion
®
ELS61-USA Hardware Interface Description
3.7 Blocking against RF on Interface Lines
83
els61-usa_hid_v01.040a
2017-08-31
Confidential / Preliminary
Page 82 of 113
The following table lists for each signal line at the module‘s SMT application interface the EMI
measures that may be implemented.
measures that may be implemented.
Table 19:
EMI measures on the application interface
Signal name
EMI measures
Remark
A
B
C
D
E
CCIN
x
x
CCRST
x
The external capacitor should be not higher
than 30pF. The value of the capacitor
depends on the external application.
CCIO
x
CCCLK
x
RXD0
x
x
x
x
x
TXD0
x
x
x
x
x
CTS0
x
x
x
x
x
RTS0
x
x
x
x
x
GPIO1/DTR0
x
x
x
x
x
GPIO2/DCD0
x
x
x
x
x
GPIO3/DSR0/SPI_CLK
x
x
x
x
x
GPIO4/FST_SHDN
x
x
x
x
x
GPIO5/LED
x
x
x
x
x
GPIO6/PWM2
x
x
x
x
x
GPIO7/PWM1
x
x
x
x
x
GPIO8/COUNTER
x
x
x
x
x
GPIO11-GPIO15
x
x
x
x
x
GPIO16/RXD1/MOSI
x
x
x
x
x
GPIO17/TXD1/MISO
x
x
x
x
x
GPIO18/RTS1
x
x
x
x
x
GPIO19/CTS1/SPI_CS
x
x
x
x
x
GPIO20/DOUT
x
x
x
x
x
GPIO21/DIN
x
x
x
x
x
GPIO22/FSC
x
x
x
x
x
GPIO23/BCLK
x
x
x
x
x
GPIO24/RING0
x
x
x
x
x
I2CDAT
x
x
The rising signal edge is reduced with an
additional capacitor.
I2CCLK x
x
V180
x
x
x
VCORE
x
x
x
BATT+
RF
(pad 53)
x
x
Measures required if BATT+
RF
is close to
internal RF antenna -
e.g., 39pF blocking capacitor to ground
BATT+
BB
(pad 204)
x
x
VUSB
x
x
x
USB_DP
It is not allowed to use any external ESD or
EMI components at this interface signal
lines.
USB_DN