Gemalto M2M GmbH ELS61-USA Benutzerhandbuch
Cinterion
®
ELS61-USA Hardware Interface Description
4.2 Mounting ELS61-USA onto the Application Platform
98
els61-usa_hid_v01.040a
2017-08-31
Confidential / Preliminary
Page 87 of 113
The central ground pads are primarily intended for stabilizing purposes, and may show some
more voids than the application interface pads at the module's rim. This is acceptable, since
they are electrically irrelevant.
more voids than the application interface pads at the module's rim. This is acceptable, since
they are electrically irrelevant.
Figure 51:
Recommended design for 110µm thick stencil (top view)
Figure 52:
Recommended design for 150µm thick stencil (top view)