WIESON INTERNATIONAL CO. LTD. WM2011WU Benutzerhandbuch

 

INTERNATIONAL 

CO., LTD. 

TYPE OF PRODUCT 

WLAN MODULE 

 

No part of the information shown of this document may be used in any way without office stamp or written consent of 

WIESON INTERNATIONAL CO., LTD. 

11

  Reference Temperature Reflow Chart   

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Note: 

1. If the system PCBA is double side design please reflow the side without this module first. 
2. Don’t let the solder machine temperature over 250℃ or follow solder paste vender’s 

recommended temperature. 

3. The Ramp-up temperature speed is 1~4 

o

C per second, the Ramp-down temperature speed is 

1~4 

o

C per second. 

4. This temperature reflow chart is for reference only, it depends on the manufaturing machine’s 

characters requirement.