HP Xeon E7-2870 643749R-L21 Benutzerhandbuch

HP BL620c G7 Intel® Xeon® E7-2820 (2.0GHz/8-core/18MB/105W) FIO Processor Kit

643757-L21

 

HP BL620c G7 Intel® Xeon® E7-2803 (1.73GHz/6-core/18MB/105W) FIO Processor Kit

643759-L21

NOTE: All DDR3 memory option kits consist of one RDIMM per kit.
NOTE: See the "Memory" section for memory guidelines, installation rules, and
additional general information.

 

 

HP 4GB (1x4GB) Dual Rank x4 PC3-10600 (DDR3-1333) Registered CAS-9 Memory Kit

500658-B21

HP 8GB (1x8GB) Dual Rank x4 PC3-10600 (DDR3-1333) Registered CAS-9 Memory Kit

500662-B21

HP 8GB (1x8GB) Dual Rank x4 PC3L-10600 (DDR3-1333) Registered CAS-9 Low Power
Memory Kit

604506-B21

HP 16GB (1x16GB) Dual Rank x4 PC3L-10600 (DDR3-1333) Registered CAS-9 LP
Memory Kit

627812-B21

HP 16GB (1x16GB) Quad Rank x4 PC3-8500 (DDR3-1066) Registered CAS-7 Memory Kit

500666-B21

HP 32GB (1x32GB) Quad Rank x4 PC3L-8500 (DDR3-1066) Registered CAS-7 LP Memory
Kit

627814-B21

HP Insight Control including 1yr 24x7 Support ProLiant ML/DL/BL-bundle Single Server
FIO License

C6N36A

NOTE: For additional options, including server blade enclosures interconnect and mezzanine options and power subsystem options;
please see the Core Options and Additional sections below and the following:
HP BladeSystem c3000 Enclosure QuickSpecs:

NOTE: The c3000 HP c-Class enclosures have full backwards and forwards compatibility, existing server blades are supported in the
new enclosures and any future server blades will be supported in the existing enclosures.
HP BladeSystem c7000 Enclosure QuickSpecs:

NOTE: The c7000 HP c-Class enclosures have full backwards and forwards compatibility, existing server blades are supported in the
new enclosures and any future server blades will be supported in the existing enclosures.
HP BladeSystem c-Class Interconnect and Mezzanine Components QuickSpecs:

Configuration Information - Factory Integrated Models

DA - 13747   Worldwide — Version 32 — June 10, 2013

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