Intel 1005M AW8063801121200 Benutzerhandbuch

72

Datasheet, Volume 1

The processor core and graphics core power plane controls allow for customization to 
implement optimal Turbo within voltage regulator thermal limitations. It is possible to 
use these power plane controls to protect the voltage regulator from overheating due 
to extended high currents. Power limiting per plane cannot be ensured in all usages. 
This function is similar to the package level long duration Turbo control. Graphics Turbo 
frequencies can be efficiently limited by setting the Secondary Plane Turbo Power Limit 
to an artificially low setting that may be designed in certain cases. Primary Plane Turbo 
Power Limit lower settings are bound to the same limits as found in the 
PACKAGE_MIN_POWER, MSR 0x614[30:16]. 

'Turbo Time Parameter' is a mathematical parameter (units in seconds) that controls 
the Intel Turbo Boost Technology algorithm using an exponentially weighted moving 
average of energy usage. During a maximum power Turbo event of about 1.25 x TDP, 
the processor could sustain POWER_LIMIT_2 for up to approximately 1.5 times the 
Turbo Time Parameter. If the power value and/or ‘Turbo Time Parameter’ is changed 
during runtime, it may take a period of time (possibly up to approximately 3 to 5 times 
the ‘Turbo Time Parameter’, depending on the magnitude of the change and other 
factors) for the algorithm to settle at the new control limits. There is an individual Turbo 
Time parameter associated with Package Power Control and another associated with 
each power plane. 

Configurable TDP (cTDP) and Low Power Mode (LPM) form a new design vector where 
the processor’s behavior and package TDP are dynamically adjusted to a desired 
system performance and power envelope. Configurable TDP and Low Power Mode 
technologies are not battery life improvement technologies, but they offer new 
opportunities to differentiate system design while running active workloads using 
Intel’s premium processor products through scalability, configurability, and adaptability. 
The scenarios or methods by which each technology is used are customizable but 
typically involve changes to TDP with a resultant change in performance depending on 
system’s usage. Either technology can be triggered by (but are not limited to) changes 
in operating system power policies, or hardware events (such as docking a system), 
flipping a switch, or pressing a button. cTDP and LPM are designed to be configured 
dynamically and do not require an operating system reboot. 

Configurable TDP is limited to a subset of Ultra and Extreme Edition parts but is subject 

to change.

With cTDP, the processor is now capable of altering the TDP power with an alternate 
ensured frequency. Configurable TDP allows operation in situations where extra cooling 
is available or situations where a cooler and quieter mode of operation is desired. 
Configurable TDP can be enabled using an Intel driver or through Hardware / 
Embedded Controller (EC) firmware. 

Implementing cTDP using the DPTF driver is recommended as Intel does not provide 
specific application or Embedded Controller (EC) source code.