Intel 1005M AW8063801121200 Benutzerhandbuch
Produktcode
AW8063801121200
Datasheet, Volume 1
77
Thermal Management
5.6
Thermal Management Features
Thermal management features for the entire processor complex (including the
processor core, the graphics core, and integrated memory controller hub) will be
referred to as processor package, or by simply the package.
processor core, the graphics core, and integrated memory controller hub) will be
referred to as processor package, or by simply the package.
Occasionally the package will operate in conditions that exceed its maximum allowable
operating temperature. This can be due to internal overheating or due to overheating in
the entire system. To protect processor package and the system from thermal failure,
several thermal management features exist to reduce package power consumption and
thereby temperature in order to remain within normal operating limits. Furthermore,
the processor supports several methods to reduce memory power.
operating temperature. This can be due to internal overheating or due to overheating in
the entire system. To protect processor package and the system from thermal failure,
several thermal management features exist to reduce package power consumption and
thereby temperature in order to remain within normal operating limits. Furthermore,
the processor supports several methods to reduce memory power.
5.6.1
Adaptive Thermal Monitor
The purpose of the Adaptive Thermal Monitor is to reduce processor core power
consumption and temperature until it operates at or below its maximum operating
temperature. Processor core power reduction is achieved by:
consumption and temperature until it operates at or below its maximum operating
temperature. Processor core power reduction is achieved by:
• Adjusting the operating frequency (using the core ratio multiplier) and input
voltage (using the SVID bus).
• Modulating (starting and stopping) the internal processor core clocks (duty cycle).
The Adaptive Thermal Monitor can be activated when any package temperature,
monitored by a digital thermal sensor (DTS), meets or exceeds its maximum junction
temperature specification (T
monitored by a digital thermal sensor (DTS), meets or exceeds its maximum junction
temperature specification (T
J,max
) and asserts PROCHOT#. The assertion of PROCHOT#
activates the thermal control circuit (TCC), and causes both the processor core and
graphics core to reduce frequency and voltage adaptively. The TCC will remain active as
long as any package temperature exceeds its specified limit. Therefore, the Adaptive
Thermal Monitor will continue to reduce the package frequency and voltage until the
TCC is de-activated.
graphics core to reduce frequency and voltage adaptively. The TCC will remain active as
long as any package temperature exceeds its specified limit. Therefore, the Adaptive
Thermal Monitor will continue to reduce the package frequency and voltage until the
TCC is de-activated.
Table 5-6.
Idle Power Specifications
Segment
Symbol
Idle Parameter
Min
Typ
Max
Units
Notes
Extreme Edition
(XE)
P
C6
Idle power in the Package C6
state
-
-
3.6
W
6, 9
P
C7
Idle power in the Package
C7state
-
-
3.5
W
6, 9
Quad Core SV
45
W
P
C6
Idle power in the Package C6
state
-
-
3.1
W
6, 9
P
C7
Idle power in the Package
C7state
-
-
3.0
W
6, 9
Dual Core and
Quad Core SV
35
W
P
C6
Idle power in the Package C6
state
-
-
3.0
W
6, 9
P
C7
Idle power in the Package
C7state
-
-
2.9
W
6, 9
Dual Core Ultra
P
C6
Idle power in the Package C6
state
-
-
2.3
W
6, 9
P
C7
Idle power in the Package
C7state
-
-
2.2
W
6, 9