HP 731179-151 Benutzerhandbuch
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each time the heat sink is removed. Replacement thermal material is included with the heat sink,
processor, and system board spare part kits.
a. Discrete models:
Thermal paste is used on the system board components (1) and (3) and on the heat sink
areas (2) and (4) that services them.
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Chapter 6 Removal and replacement procedures for Authorized Service Provider parts