Acer Intel Celeron G460 KC.G0001.460 Benutzerhandbuch
Produktcode
KC.G0001.460
Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package Datasheet
81
Thermal Specifications and Design Considerations
Thermal Specifications and Design
Considerations
Considerations
6
The Celeron processor on 0.13 micron process has an integrated heat spreader (IHS) for heatsink
attachment that is intended to provide for multiple types of thermal solutions. This section provides
information necessary for development of a thermal solution. See
attachment that is intended to provide for multiple types of thermal solutions. This section provides
information necessary for development of a thermal solution. See
for an exploded view
of an example Celeron processor on 0.13 micron process thermal solution. This is for illustration
purposes. For further thermal solution design details, refer to the Intel
purposes. For further thermal solution design details, refer to the Intel
®
Pentium
®
4 Processor in
the 478-pin Package Thermal Design Guidelines.
Note:
The processor is shipped either by itself or with a heatsink for boxed processors. See
for
details on boxed processors.
Figure 35. Example Thermal Solution (Not to Scale)
Clip Assembly
Fan / Shroud
Heatsink
Retention Mechanism
Processor
mPGA478B 478-pin Socket