Acer Intel Celeron G530 KC.53001.CDG Benutzerhandbuch
Produktcode
KC.53001.CDG
54
Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package
Datasheet
Package Mechanical Specifications
NOTES:
1. Flatness is specified as overall, not per unit of length.
2. All Dimensions are in millimeters.
2. All Dimensions are in millimeters.
4.1
Package Load Specifications
provides dynamic and static load specifications for the processor IHS. These mechanical
load limits should not be exceeded during heatsink assembly, mechanical stress testing, or standard
drop and shipping conditions. The heatsink attach solutions must not induce continuous stress onto
the processor with the exception of a uniform load to maintain the heatsink-to-processor thermal
interface contact. It is not recommended to use any portion of the processor substrate as a
mechanical reference or load bearing surface for thermal solutions.
drop and shipping conditions. The heatsink attach solutions must not induce continuous stress onto
the processor with the exception of a uniform load to maintain the heatsink-to-processor thermal
interface contact. It is not recommended to use any portion of the processor substrate as a
mechanical reference or load bearing surface for thermal solutions.
Figure 31. IHS Flatness Specification
SUBSTRATE
IHS
SUBSTRATE
IHS
IHS
Table 31. Package Dynamic and Static Load Specifications
Parameter
Max
Unit
Notes
Static
100
lbf
1,
2
NOTES:
1.
This specification applies to a uniform compressive load.
2.
This is the maximum static force that can be applied by the heatsink and clip to maintain
the heatsink and processor interface.
the heatsink and processor interface.
Dynamic
200
lbf
3
3.
Dynamic loading specifications are defined assuming a maximum duration of 11 ms and
200 lbf is achieved by superimposing a 100 lbf dynamic load (1 lbm at 50 g) on the static
compressive load.
200 lbf is achieved by superimposing a 100 lbf dynamic load (1 lbm at 50 g) on the static
compressive load.