Acer Intel Celeron G530 KC.53001.CDG Benutzerhandbuch

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KC.53001.CDG
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Intel
®
 Celeron
®
 Processor on 0.13 Micron Process in the 478-Pin Package Datasheet
97
 Boxed Processor Specifications
8.4
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the boxed 
processor.
8.4.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's 
temperature specification is also a function of the thermal design of the entire system and is 
ultimately the responsibility of the system integrator. The processor temperature is specified in 
. The boxed processor fan heatsink is able to keep the processor temperature within the 
specifications (see 
in chassis that provide good thermal management. For the boxed 
processor fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink 
is unimpeded. Airflow is into the center and out of the sides of the fan heatsink. Airspace is 
required around the fan to ensure that the airflow through the fan heatsink is not blocked. Blocking 
the airflow to the fan heatsink reduces the cooling efficiency and decreases fan life. 
 illustrate an acceptable airspace clearance for the fan heatsink. The air temperature 
entering the fan should be kept below 40 °C. Again, meeting the processor's temperature 
specification is the responsibility of the system integrator. 
 
Figure 43. Boxed Processor Fan Heatsink Airspace Keep-Out Requirements 
(Side 1 View)