Intel MFS5000SI MFS5000SIB Benutzerhandbuch

Intel® Compute Module MFS5000SI TPS  

0BIntroduction 

1.  Introduction 

This Technical Product Specification (TPS) provides board-specific information detailing the features, 
functionality, and high-level architecture of the Intel

®

 Compute Module MFS5000SI. The Intel

®

should also be referenced for more in-depth detail of 

various board subsystems, including chipset, BIOS, System Management, and System Management 
software. 

1.1  Chapter Outline 

This document is divided into the following chapters: 

ƒ

  Chapter 1 – Introduction 

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  Chapter 2 – Product Overview 

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  Chapter 3 – Functional Architecture 

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  Chapter 4 – Connector / Header Locations and Pin-outs 

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  Chapter 5 – Jumper Block Settings 

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  Chapter 6 – Product Regulatory Requirements 

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  Appendix A – Integration and Usage Tips 

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  Appendix B – BMC Sensor Tables 

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  Appendix C – Post Error Messages and Handling 

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  Appendix D – Supported Intel

®

 Modular Server System 

1.2  Intel

 Compute Module Use Disclaimer 

Intel

®

 Modular Server components require adequate airflow to cool. Intel ensures through its own chassis 

development and testing that when these components are used together, the fully integrated system will 
meet the intended thermal requirements. It is the responsibility of the system integrator who chooses not 
to use Intel-developed server building blocks to consult vendor datasheets and operating parameters to 
determine the amount of airflow required for their specific application and environmental conditions. Intel 
Corporation cannot be held responsible if components fail or the system does not operate correctly when 
used outside any of their published operating or non-operating limits. 

Revision 1.4 

 

1 

Intel order number: E15154-007